Littelfuse SP3003 Series - Manual (Page 5)

© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 08/20/13
TVS Diode Arrays
(SPA ® Diodes)
Low Capacitance ESD Protection - SP3003 Series
Package Dimensions — SOT563
Package SOT 563
Pins 6
Millimeters Inches
Min Max Min Max
A 0.50 0.60 0.020 0.024
B 0.17 0.27 0.007 0.011
c 0.08 0.18 0.003 0.007
D 1.50 1.70 0.059 0.067
E 1.10 1.30 0.043 0.051
e 0.50 BSC 0.020 BSC
L 0.10 0.30 0.004 0.012
HE 1.50 1.70 0.059 0.067
c
HE
L
A
D
6 4
2 3
E
e
B
5
Recommended
Solder Pad Layout
Package Dimensions — MSOP10
Recommanded Solder Pad Layout
Package Dimensions —µDFN-6L
Package µ DFN-6L
JEDEC MO-229
Pins 6
Millimeters Inches
Min Max Min Max
A 0.45 0.55 0.018 0.022
A1 0.00 0.05 0.000 0.002
A3 0.125REF 0.005REF
b 0.35 0.45 0.014 0.018
b1 0.15 0.25 0.006 0.010
D 1.55 1.65 0.062 0.065
D2 - - - -
E 0.95 1.05 0.038 0.042
E2 - - - -
e 0.50REF 0.020REF
L 0.33 0.43 0.013 0.017
Recommended
Solder Pad Layout
Recommended Solder Pad
Layout
Package MSOP10
JEDEC MO-187
Pins 10
Millimeters Inches
Min Max Min Max
A - 1.10 - 0.043
A1 0.00 0.15 0.000 0.006
B 0.17 0.27 0.007 0.011
c 0.08 0.23 0.003 0.009
D 2.90 3.10 0.114 0.122
E 4.67 5.10 0.184 0.200
E1 2.90 3.10 0.114 0.122
e 0.50 BSC 0.020 BSC
HE 0.40 0.80 0.016 0.031