Littelfuse SP4061 Series - Manual (Page 3)

163 ©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to
www.littelfuse.com/SPA for current information.
TVS Diode Arrays (SPA ™ Family of Products)
Revision: March 20, 2012
Lightning Surge Protection - SP4061 Series
SP4061 Series
SP4061
Capacitance vs. Bias
0.0
1.0
2.0
3.0
4.0
5.0
0.0 0.5 1.0 1.5 2.0 2.5
DC Bias (V)
Capacitance (pF)
Time
T
emperature
T
P
T
L
T
S(max)
T
S(min)
25
t
P
t
L
t
S
time to peak temperature
Preheat Preheat
Ramp-up Ramp-up
Ramp-down Ramp-do
Critical Zone
T
L to T P
Critical Zone
T
L to T P
Reflow Condition Pb – Free assembly
Pre Heat
- Temperature Min (T
s(min)
) 150°C
- Temperature Max (T
s(max)
) 200°C
- Time (min to max) (t
s
) 60 – 180 secs
Average ramp up rate (Liquidus) Temp
(T
L
) to peak
3°C/second max
T
S(max)
to T
L
- Ramp-up Rate 3°C/second max
Reflow
- Temperature (T
L
) (Liquidus) 217°C
- Temperature (t
L
) 60 – 150 seconds
Peak Temperature (T
P
) 260 +0/-5 °C
Time within 5°C of actual peak
Temperature (t
p
)
20 – 40 seconds
Ramp-down Rate 6°C/second max
Time 25°C to peak Temperature (T
P
) 8 minutes Max.
Do not exceed 260°C
Soldering Parameters
Ordering Information
Part Number Package Marking Min. Order Qty.
SP4061-04UTG μDFN-10 TH4 3000
Part Numbering System
Part Marking System
SP 4061 04 U T G
Series
Number of
Channels
Package
U= μDFN-10
T= Tape & Reel
G= Green
-
Silicon Protection
Array (SPA
TM )
Family of
TVS Diode Arrays
T * 4
Product Series
T = SP4061
Assembly Site
Number of
Channels
Product Characteristics
Lead Plating Pre-Plated Frame
Lead Material Copper Alloy
Lead Coplanarity 0.0004 inches (0.102mm)
Substitute Material Silicon
Body Material Molded Epoxy
Flammability UL 94 V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4.. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.