Littelfuse SP3006 Series - Manual (Page 3)

3 ©2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
TVS Diode Arrays
(SPA ® Diodes)
Revision: July 17, 2013
SP3006 Series
SP30
06 S
eries
Low Capacitance ESD Protection - SP3006 Series
Product Characteristics
Lead Plating Pre-Plated Frame
Lead Material Copper Alloy
Lead Coplanarity 0.0004 inches (0.102mm)
Substitute
Material
Silicon
Body Material Molded Epoxy
Flammability UL 94 V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
Time
Temperature
T
P
T
L
T
S(max)
T
S(min)
25
t
P
t
L
t
S
time to peak temperature
Preheat Preheat
Ramp-up Ramp-up
Ramp-down Ramp-do
Critical Zone
T L to T P
Critical Zone
T L to T P
Reflow Condition Pb – Free assembly
Pre Heat
- Temperature Min (T
s(min)
) 150°C
- Temperature Max (T
s(max)
) 200°C
- Time (min to max) (t
s
) 60 – 180 secs
Average ramp up rate (Liquidus) Temp
(T
L
) to peak
3°C/second max
T
S(max)
to T
L
- Ramp-up Rate 3°C/second max
Reflow
- Temperature (T
L
) (Liquidus) 217°C
- Temperature (t
L
) 60 – 150 seconds
Peak Temperature (T
P
) 260 +0/-5 °C
Time within 5°C of actual peak
Temperature (t
p
)
20 – 40 seconds
Ramp-down Rate 6°C/second max
Time 25°C to peak Temperature (T
P
) 8 minutes Max.
Do not exceed 260°C
Soldering Parameters
Part Numbering System
SP3006 TG
Series
Number of Channels
02 = 2 channel
Package
X = SOT563
T= Tape & Reel
G= Green
TVS Diode Arrays
(SPA ® Diodes)
02 X
Part Marking System
1 *
Product Series
1=SP3006 series
Assembly Site
(varies)
Number of Channels
(varies)
1 * 2
2
Ordering Information
Part Number Package Marking Min. Order Qty.
SP3006-02XTG SOT563 1 * 2 3000