Rainbow Electronics MAX17036 - Manual (Page 38)

MAX17030/MAX17036
1/2/3 Phase-Quick-PWM
IMVP-6.5 VID Controllers
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Package Information
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PACKAGE TYPE PACKAGE CODE DOCUMENT NO.
40 TQFN-EP T4055-2 21-0140
Chip Information
PROCESS: BiCMOS
4) Make the DC-DC controller ground connections as
shown in the standard application circuits. This dia-
gram can be viewed as having four separate ground
planes: input/output ground, where all the high-
power components go; the power ground plane,
where the GND pin and V
DD
bypass capacitor go;
the master’s analog ground plane, where sensitive
analog components, the master’s GND pin and V
CC
bypass capacitor go; and the slave’s analog ground
plane, where the slave’s GND pin and V
CC bypass
capacitor go. The master’s GND plane must meet
the GND plane only at a single point directly
beneath the IC. Similarly, the slave’s GND plane
must meet the GND plane only at a single point
directly beneath the IC. The respective master and
slave ground planes should connect to the high-
power output ground with a short metal trace from
GND to the source of the low-side MOSFET (the
middle of the star ground). This point must also be
very close to the output capacitor ground terminal.
5) Connect the output power planes (V CORE and sys-
tem ground planes) directly to the output filter
capacitor positive and negative terminals with multi-
ple vias. Place the entire DC-DC converter circuit as
close to the CPU as is practical.