Rainbow Electronics MAX13256 - Manual (Page 2)

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MAX13256
36V H-Bridge Transformer
Driver for Isolated Supplies
(Voltages referenced to GND.)
V
DD
, FAULT ...........................................................-0.3V to +40V
ST1, ST2 ................................................... -0.3V to (V
DD
+ 0.3V)
CLK, ITH, EN ...........................................................-0.3V to +6V
FAULT Continuous Current ............................................. Q50mA
ST1, ST2 Continuous Current ........................................ Q850mA
Continuous Power Dissipation (T
A
= +70NC)
TDFN (Four-Layer Board)
(derate 24.4mW/NC above +70NC) .........................1951.2mW
TDFN (Single-Layer Board)
(derate 18.5mW/NC above +70NC) .........................1481.5mW
Operating Temperature Range ........................ -40NC to +125NC
Junction Temperature .....................................................+150NC
Storage Temperature Range ............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ...............................+300NC
Soldering Temperature (reflow) ......................................+260NC
TDFN (Four-Layer Board)
Junction-to-Ambient Thermal Resistance (B
JA
) ..........41NC/W
Junction-to-Case Thermal Resistance (B
JC
) .................9NC/W
TDFN (Single-Layer Board)
Junction-to-Ambient Thermal Resistance (B
JA
) ..........54NC/W
Junction-to-Case Thermal Resistance (B
JC
) .................9NC/W
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7. For detailed
information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial .
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
ELECTRICAL CHARACTERISTICS
(V
DD
= 8V to 36V, V
EN
= 0V, T
A
= -40NC to +125NC, unless otherwise noted. Typical values are at T
A
= +25NC.) (Note 2)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
DC CHARACTERISTICS
Supply Voltage Range
V
DD
(Note 3) 8 36 V
Supply Current I
DD
V
EN
= 0V, V
CLK
= 0V, R
LIM
= 1000I,
ST1/ST2 not connected
6 9 mA
Disable Supply Current I
DIS
V
EN
= 3.3V, V
CLK
= 0V 0.65 1.1 mA
Driver Output Resistance
R
OH
ST1 = ST2 = high, I
ST1, ST2
= +300mA,
R
LIM
= 1000I
1 1.5
I
R
OL
ST1 = ST2 = low, I
ST1, ST2
= -300mA,
R
LIM
= 1000I
0.6 1.0
Undervoltage-Lockout Threshold V
UVLO
V
DD
rising 5.9 6.3 6.9 V
Undervoltage-Lockout Threshold
Hysteresis
V
UVLO_HYST
300 mV