Package information, Chip information – Rainbow Electronics MAX17031 User Manual

Page 24

MAX17031

Dual Quick-PWM Step-Down Controller with Low-
Power LDO and RTC Regulator for MAIN Supplies

Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.

24 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600

is a registered trademark of Maxim Integrated Products, Inc.

Layout Procedure

1) Place the power components first, with ground ter-

minals adjacent (N

source, C

, C

OUT_

, and D

anode). If possible, make all these connections on
the top layer with wide, copper-filled areas.

2) Mount the controller IC adjacent to the low-side

MOSFET, preferably on the back side opposite N

and N

in order to keep LX_, GND, DH_, and the

DL_ gate-drive lines short and wide. The DL_ and
DH_ gate traces must be short and wide (50 mils to
100 mils wide if the MOSFET is 1in from the con-
troller IC) to keep the driver impedance low and for
proper adaptive dead-time sensing.

3) Group the gate-drive components (BST_ capacitor,

bypass capacitor) together near the controller IC.

4) Make the DC-DC controller ground connections as

shown in Figure 1. This diagram can be viewed as
having two separate ground planes: power ground,
where all the high-power components go; and an ana-
log ground plane for sensitive analog components.
The analog ground plane and power ground plane
must meet only at a single point directly at the IC.

5) Connect the output power planes directly to the out-

put filter capacitor positive and negative terminals
with multiple vias. Place the entire DC-DC converter
circuit as close to the load as is practical.

Package Information

For the latest package outline information and land patterns, go
to

www.maxim-ic.com/packages

PACKAGE TYPE

PACKAGE CODE

DOCUMENT NO.

24 TQFN

T2444-3

21-0139

Chip Information

TRANSISTOR COUNT: 12,197

PROCESS: BiCMOS