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Rainbow Electronics MAX17031 User Manual

Page 22

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MAX17031

Power-MOSFET Selection

Most of the following MOSFET guidelines focus on the
challenge of obtaining high load-current capability
when using high-voltage (> 20V) AC adapters. Low-
current applications usually require less attention.

The high-side MOSFET (N

H

) must be able to dissipate

the resistive losses plus the switching losses at both
V

IN(MIN)

and V

IN(MAX)

. Ideally, the losses at V

IN(MIN)

should be roughly equal to the losses at V

IN(MAX)

, with

lower losses in between. If the losses at V

IN(MIN)

are

significantly higher, consider increasing the size of N

H

.

Conversely, if the losses at V

IN(MAX)

are significantly

higher, consider reducing the size of N

H

. If V

IN

does

not vary over a wide range, maximum efficiency is
achieved by selecting a high-side MOSFET (N

H

) that

has conduction losses equal to the switching losses.

Choose a low-side MOSFET (N

L

) that has the lowest

possible on-resistance (R

DS(ON)

), comes in a moder-

ate-sized package (i.e., 8-pin SO, DPAK, or D

2

PAK),

and is reasonably priced. Ensure that the MAX17031
DL_ gate driver can supply sufficient current to support
the gate charge and the current injected into the para-
sitic drain-to-gate capacitor caused by the high-side
MOSFET turning on; otherwise, cross-conduction prob-
lems could occur. Switching losses are not an issue for
the low-side MOSFET since it is a zero-voltage switched
device when used in the step-down topology.

Power-MOSFET Dissipation

Worst-case conduction losses occur at the duty factor
extremes. For the high-side MOSFET (N

H

), the worst-

case power dissipation due to resistance occurs at
minimum input voltage:

Generally, use a small high-side MOSFET to reduce
switching losses at high input voltages. However, the
R

DS(ON)

required to stay within package power-dissi-

pation limits often limits how small the MOSFET can be.
The optimum occurs when the switching losses equal
the conduction (R

DS(ON)

) losses. High-side switching

losses do not become an issue until the input is greater
than approximately 15V.

Calculating the power dissipation in high-side
MOSFETs (N

H

) due to switching losses is difficult, since

it must allow for difficult-to-quantify factors that influ-
ence the turn-on and turn-off times. These factors
include the internal gate resistance, gate charge,
threshold voltage, source inductance, and PCB layout

characteristics. The following switching loss calculation
provides only a very rough estimate and is no substitute
for breadboard evaluation, preferably including verifica-
tion using a thermocouple mounted on N

H

:

where C

OSS

is the high-side MOSFET’s output capaci-

tance, Q

G(SW)

is the charge needed to turn on the high-

side MOSFET, and I

GATE

is the peak gate-drive

source/sink current (1A typ).

Switching losses in the high-side MOSFET can become
a heat problem when maximum AC adapter voltages
are applied due to the squared term in the switching-
loss equation provided above. If the high-side MOSFET
chosen for adequate R

DS(ON)

at low battery voltages

becomes extraordinarily hot when subjected to
V

IN(MAX)

, consider choosing another MOSFET with

lower parasitic capacitance.

For the low-side MOSFET (N

L

), the worst-case power

dissipation always occurs at maximum battery voltage:

The absolute worst case for MOSFET power dissipation
occurs under heavy overload conditions that are
greater than I

LOAD(MAX)

but are not high enough to

exceed the current limit and cause the fault latch to trip.
To protect against this possibility, “overdesign” the cir-
cuit to tolerate:

where I

VALLEY(MAX)

is the maximum valley current

allowed by the current-limit circuit, including threshold
tolerance and sense-resistance variation. The
MOSFETs must have a relatively large heatsink to han-
dle the overload power dissipation.

Choose a Schottky diode (D

L

) with a forward voltage

drop low enough to prevent the low-side MOSFET’s
body diode from turning on during the dead time. As a
general rule, select a diode with a DC current rating
equal to 1/3 the load current. This diode is optional and
can be removed if efficiency is not critical.

I

I

I

LIR

LOAD

VALLEY MAX

LOAD MAX

=

+


⎝⎜


⎠⎟

(

)

(

)

2

PD (NL Resistive) = 1



V

V

OUT

IN MAX

(

)

⎢⎢

(

)

I

R

LOAD

DS ON

2

(

)

PD (NH Switching) =

V

I

f

Q

I

IN MAX LOAD SW

G SW

(

)

(

)

G

GATE

I

V


⎝⎜


⎠⎟

+

N

N

OSS SW

C

f

2

2

PD (NH Resistive) =

V

V

I

R

OUT

IN

LOAD

D


⎝⎜


⎠⎟

(

)

2

S

S ON

(

)

Dual Quick-PWM Step-Down Controller with Low-
Power LDO and RTC Regulator for MAIN Supplies

22

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