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Pin description (continued) – Rainbow Electronics MAX17127 User Manual

Page 10

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10 _____________________________________________________________________________________

MAX17127

Six-String WLED Driver with Integrated

Step-Up Converter

Pin Description (continued)

PIN

NAME

FUNCTION

7

FB5

LED String 5 Cathode Connection. FB5 is the open-drain output of an internal regulator, which
controls current through FB5. FB5 can sink up to 30mA. If unused, connect FB5 to AGND.

8

FB4

LED String 4 Cathode Connection. FB4 is the open-drain output of an internal regulator, which
controls current through FB4. FB4 can sink up to 30mA. If unused, connect FB4 to AGND.

9

AGND

Analog Ground

10

FB3

LED String 3 Cathode Connection. FB3 is the open-drain output of an internal regulator, which
controls current through FB3. FB3 can sink up to 30mA. If unused, connect FB3 to AGND.

11

FB2

LED String 2 Cathode Connection. FB2 is the open-drain output of an internal regulator, which
controls current through FB2. FB2 can sink up to 30mA. If unused, connect FB2 to AGND.

12

FB1

LED String 1 Cathode Connection. FB1 is the open-drain output of an internal regulator, which
controls current through FB1. FB1 can sink up to 30mA. If unused, connect FB1 to AGND.

13

R_FPWM

Connect R_FPWM to AGND

14

OVP

Overvoltage Sense. Connect OVP to the boost converter output through a resistor:

V

OVP

= 1.25V O (1 + R

1

/R

2

)

15

PGND

Boost Regulator Power Ground

16

SW

Boost Regulator Power Switch Node

17

I.C.

Internal Connection. Not connected externally.

18

COMP

Step-Up Converter Compensation Pin. Connect a ceramic capacitor in series with a resistor from
COMP to AGND.

19

V

IN

Supply Input. V

IN

biases the internal 5V linear regulator that powers the device. Bypass V

IN

to

AGND directly at the pin with a 0.1FF or greater ceramic capacitor.

20

PWM

PWM Signal Input. This signal is used for brightness control. The brightness is proportional to the
PWM duty cycle, and the PWM signal directly controls the LED turning on/off.

EP

Exposed Backside Pad. Solder to the circuit board ground plane with sufficient copper connection
to ensure low thermal resistance. See the PCB Layout Guidelines section.