20etf..spbf soft recovery series, Vishay high power products, Electrical specifications – Vishay 20ETF..SPbF Soft Recovery Series User Manual
Page 2: Recovery characteristics, Thermal - mechanical specifications

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Document Number: 94097
2
Revision: 05-Jun-08
20ETF..SPbF Soft Recovery Series
Vishay High Power Products
Surface Mountable Fast
Soft Recovery Rectifier Diode, 20 A
Note
(1)
When mounted on 1" square (650 mm
2
) PCB of FR-4 or G-10 material 4 oz. (140 µm) copper 40 °C/W
For recommended footprint and soldering techniques refer to application note #AN-994
ELECTRICAL SPECIFICATIONS
PARAMETER SYMBOL
TEST
CONDITIONS
VALUES
UNITS
Maximum forward voltage drop
V
FM
20 A, T
J
= 25 °C
1.30
V
60 A, T
J
= 25 °C
1.67
Forward slope resistance
r
t
12.5
m
Ω
Threshold voltage
V
F(TO)
T
J
= 150 °C
0.9
V
Maximum reverse leakage current
I
RM
T
J
= 25 °C
V
R
= Rated V
RRM
0.1
mA
T
J
= 150 °C
5.0
RECOVERY CHARACTERISTICS
PARAMETER
SYMBOL
TEST CONDITIONS
VALUES
UNITS
Reverse recovery time
t
rr
I
F
at 20 Apk
100 A/µs
25 °C
160
ns
Reverse recovery current
I
rr
10
A
Reverse recovery charge
Q
rr
1.25
µC
Snap factor
S
Typical
0.6
I
FM
t
rr
dir
dt
I
RM(REC)
Q
rr
t
t
a
t
b
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
TEST CONDITIONS
VALUES
UNITS
Maximum junction and storage
temperature range
T
J
, T
Stg
- 40 to 150
°C
Maximum thermal resistance,
junction to case
R
thJC
DC
operation
0.9
°C/W
Maximum thermal resistance
junction to ambient (PCB mount)
R
thJA
(1)
40
Soldering temperature
T
S
240
°C
Approximate weight
2
g
0.07
oz.
Marking device
Case style D
2
PAK (SMD-220)
20ETF02S
20ETF04S
20ETF06S