beautypg.com

Solder profile, Reflow soldering information, High temperature headers – A P Products Male and Female Header User Manual

Page 43: A p products gmbh, Profile feature pb-free assembly

background image

A P Products GmbH

A P Products Ltd.

A P Products S.r.l.

Bäumlesweg 21 – 23

80 Cromwell Road

Viale Abruzzi, 87

71093 Weil im Schönbuch

Saffron Walden, CB11 4BE

20131 Milano

Germany

Great Britain

Italia

Tel: +49-7157-5348-0

Tel: +44-1799-526602

Tel: +39-02-29404697

Fax: +49-7157-5348-39

Fax: +44-1799-521408

Fax: +39-02-29523280

Web: www.ap-products.de

Web: www.ap-products.co.uk

Web: www.ap-products.it

E-mail: [email protected]

E-mail: [email protected]

E-mail: [email protected]

29/11/2007 16.07.00

Reflow Soldering Information




All Components should be soldered according to
IPC/JEDEC J-STD-020C temperature-profile
for leadfree reflow-soldering (maximum values):












A P Products GmbH

High Temperature Headers

Solder Profile

Profile Feature

Pb-Free assembly

Average Ramp-Up Rate (Ts

max

to T

p

)

3 °C / second max.

Preheat
- Temperature Min (Ts

min

)

- Temperature Max (Ts

max

)

- Time (ts

min

to ts

max

)


150°C
200°C
60-180 seconds

Time maintained above:
- Temperature (T

L

)

- Time (t

L

)


217°C
60-150 seconds

Peak/Classification Temperature (T

p

)

260°C +/- 5°C

Time within 5°C of actual Peak
Temperature (t

p

)

10-15 seconds

Ramp-Down Rate

6°C / second max.

Time 25°C to Peak Temperature

8 minutes max.

Engineering Note:
The information presented in this
datasheet is accurate to the best of
our knowledge.
Due to ongoing efforts to advance
design and material performance,
this information is subject to change
without notice.