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NEC PD75P308 User Manual

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µ

PD75P308

4

CONTENTS

1.

PIN FUNCTIONS .................................................................................................................................

5

1.1

PORT PINS ................................................................................................................................................. 5

1.2

NON PORT PINS ....................................................................................................................................... 6

1.3

PIN INPUT/OUTPUT CIRCUITS ................................................................................................................ 7

1.4

NOTES ON USING P00/INT4 AND RESET PINS ..................................................................................... 9

2.

DIFFERENCES BETWEEN

µ

PD75P308 AND

µ

PD75308 ..................................................................

10

3.

WRITING AND VERIFYING PROM (PROGRAM MEMORY) ...........................................................

11

3.1

OPERATION MODES FOR WRITING/VERIFYING PROGRAM MEMORY ............................................ 11

3.2

PROGRAM MEMORY WRITE PROCEDURE .......................................................................................... 12

3.3

PROGRAM MEMORY READ PROCEDURE ............................................................................................ 13

3.4

ERASURE (

µ

PD75P308K ONLY) ............................................................................................................. 14

4.

ELECTRICAL SPECIFICATIONS ........................................................................................................

15

5.

PACKAGE DRAWINGS ......................................................................................................................

28

6.

RECOMMENDED SOLDERING CONDITIONS .................................................................................

30

APPENDIX A. DEVELOPMENT TOOLS .................................................................................................

31

APPENDIX B. RELATED DOCUMENTS ................................................................................................

32