Intel 5400 Series - Manual (Page 55)

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 55
1U Alternative Heatsink Thermal/Mechanical Design
x = Processor power value (W)
Figure A-3 below shows the comparison of this reference thermal solution’s Thermal
Profile to the Quad-Core Intel® Xeon® Processor E5400 Series Thermal Profile
specification. The 1U alternative solution meets the Thermal Profile with 0.5°C margin
at the upper end (TDP). By designing to Thermal Profile, it is ensured that no
measurable performance loss due to TCC activation is observed under the given
environmental conditions.
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Figure A-3. 1U Alternative Heatsink Thermal Adherence to Quad-Core Intel® Xeon®
Processor L5400 Series Thermal Profile
35
40
45
50
55
0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80
Tcase
(
C
)
T
C AS E_M A X
@ TD P
1U A lternative H eatsink
Y = 0.331 * X + 40
Therm al Profile
Y = 0.298 * X + 43.2
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