Series thermal profile b, Figure 2-20 – Intel 5400 Series User Manual
Page 44
Thermal/Mechanical Reference Design
44
Quad-Core Intel® Xeon® Processor 5400 Series TMDG
The 1U CEK Intel reference thermal solution is designed to meet the Thermal Profile
specification for the Quad-Core Intel® Xeon® Processor E5400 Series. From
the three-sigma (mean+3sigma) performance of the thermal solution is computed to
be 0.246 °C/W and the processor local ambient temperature (T
LA
) for this thermal
solution is 40 °C. Hence, the Thermal Profile equation for this thermal solution is
calculated as:
Equation 2-10.y = 0.246*X + 40
where,
y = Processor T
CASE
value (°C)
x = Processor power value (W)
below shows the comparison of this reference thermal solution’s Thermal
Profile to the Quad-Core Intel® Xeon® Processor E5400 Series Thermal Profile
specification. The 1U CEK solution meets the Thermal Profile with 7.3°C margin at the
upper end (TDP). By designing to Quad-Core Intel® Xeon® Processor E5400 Series
Thermal Profile, it is ensured that no measurable performance loss due to TCC
activation is observed under the given environmental conditions.
Figure 2-20. 1U CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor X5400
Series Thermal Profile B
40
45
50
55
60
65
0
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
Power (W)
Tem
p
e
ra
tu
re
(
C
)
Thermal Profile B
Y = 0.221 * X + 43.5
1U CEK Reference Solution
Y = 0.246 * X + 40
T
CASE_MAX_B
@ TDP
90
100
110
TDP
120
70