Intel 5400 Series - Manual (Page 39)

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 39
Thermal/Mechanical Reference Design
2.5.4 Assembly Overview of the Intel Reference Thermal
Mechanical Design
The reference design heatsinks that meet the Quad-Core Intel® Xeon® Processor 5400
Series thermal performance targets are called the Common Enabling Kit (CEK)
heatsinks, and are available in 1U, 2U, & 2U+ form factors. Each CEK consists of the
following components:
• Heatsink (with captive standoff and screws)
• Thermal Interface Material (TIM)
• CEK Spring
2.5.4.1 Geometric Envelope
The baseboard keepout zones on the primary and secondary sides and height
restrictions under the enabling component region are shown in detail in
Appendix B .
The overall volumetric keep in zone encapsulates the processor, socket, and the entire
thermal/mechanical enabling solution.
2.5.4.2 Assembly Drawing
Figure 2-16. Exploded View of CEK Thermal Solution Components