Intel 5400 Series - Manual (Page 10)

Introduction
10 Quad-Core Intel® Xeon® Processor 5400 Series TMDG
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1.4 Definition of Terms
Clovertown_Harpertown_Wolfdale-DP Processor Enabled Components
CEK Thermal Models (in Flotherm* and Icepak*)
Available electronically
Clovertown_Harpertown_Wolfdale-DP Processor Package Thermal
Models (in Flotherm and Icepak)
Available electronically
RS - Wolfdale Processor Family BIOS Writers Guide (BWG) See Note following table.
Thin Electronics Bay Specification (A Server System Infrastructure (SSI)
Specification for Rack Optimized Servers
www.ssiforum.com
Table 1-1. Reference Documents (Sheet 2 of 2)
Document Comment
Table 1-2. Terms and Descriptions (Sheet 1 of 2)
Term Description
Bypass Bypass is the area between a passive heatsink and any object that can act to form a
duct. For this example, it can be expressed as a dimension away from the outside
dimension of the fins to the nearest surface.
DTS Digital Thermal Sensor replaces the Tdiode in previous products and uses the same
sensor as the PROCHOT# sensor to indicate the on-die temperature. The temperature
value represents the number of degrees below the TCC activation temperature.
MSR The processor provides a variety of model specific registers that are used to control and
report on processor performance. Virtually all MSRs handle system related functions and
are not accessible to an application program.
FMB Flexible Motherboard Guideline: an estimate of the maximum value of a processor
specification over certain time periods. System designers should meet the FMB values to
ensure their systems are compatible with future processor releases.
FSC Fan Speed Control
IHS Integrated Heat Spreader: a component of the processor package used to enhance the
thermal performance of the package. Component thermal solutions interface with the
processor at the IHS surface.
LGA771 Socket The Quad-Core Intel® Xeon® Processor 5400 Series interfaces to the baseboard
through this surface mount, 771 Land socket. See the LGA771 Socket Mechanical
Design Guide for details regarding this socket.
P
MAX
The maximum power dissipated by a semiconductor component.
PECI A proprietary one-wire bus interface that provides a communication channel between
Intel processor and chipset components to external thermal monitoring devices, for use
in fan speed control. PECI communicates readings from the processors Digital Thermal
Sensor. PECI replaces the thermal diode available in previous processors.
Ψ
CA
Case-to-ambient thermal characterization parameter (psi). A measure of thermal
solution performance using total package power. Defined as (T
CASE
– T
LA
) / Total
Package Power. Heat source should always be specified for Ψ measurements.
Ψ
CS
Case-to-sink thermal characterization parameter. A measure of thermal interface
material performance using total package power. Defined as (T
CASE
– T
S
) / Total
Package Power.
Ψ
SA
Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal
performance using total package power. Defined as (T
S
– T
LA
) / Total Package Power.
T
CASE
The case temperature of the processor, measured at the geometric center of the topside
of the IHS.
T
CASE
_
MAX
The maximum case temperature as specified in a component specification.
TCC Thermal Control Circuit: Thermal monitor uses the TCC to reduce the die temperature
by using clock modulation and/or operating frequency and input voltage adjustment
when the die temperature is very near its operating limits.