Sundance SMT166 - Manual (Page 26)

4.3 Cooling of the board
Elements on the board such as the memory, power supplies, CPLD should not
require any specific cooling solutions. When it comes to the FPGAs, by the amount
of current it can draw and the logic they can implement, they will require a cooling
solution.
Xilinx ISE software can be of great to evaluate the size of the heat sink or fan. It
indeed incorporates a power estimator that can be run from an existing FPGA
design. This operation will take place at a later stage and also to validate the FPGA
pinout.
In the mean time, we could think of a solution based on crossflow blowers. A couple
could be used instead of metal stand-off (pillars) to rest the board and blowing
towards the FPGA, which could also receive a high-efficiency heat sink (fins).
Figure 9 - Crossflow blower.
It is recommended that the supplied enclosure (if purchased) be used for
development. This includes two crossflow blowers which are required to keep the
operating temperatures of the Virtex 6 FPGAs within their operational ranges.
Product Specification SMT166 Page 26 of 44 Last Edited: 17/06/2014 16:12:00