HP DX2390 - Manual (Page 26)

Other TIA/EIA 602 standard AT command set
Integrated DTE interface with speeds of up to 115.2 Kbps, parallel 16550a
UART-compatible interface
Optional ring wakeup signal
Operating Temperature32° to 158° F (0° to 70° C)
Operating Humidity 20% to 90%, non-condensing
Power Requires a 3.3-V auxiliary power rail on PCI express bus
Uses only one PCI express load (i.e., one grant/request pair), one shared
IRQ, one electrical load
Chipset LSI SV92EX – Integrated PCI interface with 3.3-V tolerant buffers and CardBus
support
Dimensions (L X H) Complies with PCI express low profile specifications-—6.7 x 2.3 in (17.0 x
5.8 cm) and supports high- and low-profile brackets
Connection Single RJ-11 connector
Other Features Digital line protection, call progress monitoring via on-board piezo device,
support for high profile and low profile brackets, PnP ID support
Safety UL recognized to UL 1950, 3 rd edition (U.S. and Canada); IEC 950 (TUV,
NEMKO, DEMKO, SEMKO); CE Mark, EC 950 (TUV, NEMKO, DEMKO,
SEMKO, CE mark
EMC FCC Part 15, IC ES003, EN 55022, 3 rd edition, EN 55024, annex A, EN
61000-4-6, EN 61000-4-8
Telecom FCC Part 68, IC-CS-03 (Canada); Worldwide PTT approvals
Not available in Korea or the Republic of South Africa.
Other The SV92EX device is packaged in a 32-pin micro leadless chip carrier
(MLCC). The SV92EX is fully compliant with the PCI Express revision 1.1
specification. WHQL approved; ASPM compliant.
QuickSpecs
HP Compaq dx2390 Microtower Business PC
(EMEA, APJ, and Brazil Only)
Technical Specifications - Communications
DA - 12990 Worldwide QuickSpecs — Version 8 — 4/3/2009 Page 26