Quickspecs – HP DX2390 User Manual
Page 20
Environmental
Operating temperature
32° to 131°F (0° to 55° C)
Operating humidity
85% at 131° F (55° C)
Dimensions
4.75 x 2.25 x 0.8 in (12.1 x 5.7 x 2.0 cm)
Operating system driver
support
Windows Vista Business 64*, Windows Vista Business 32*, Windows Vista
Home Basic 32*, Windows XP Professional or Windows XP Home 32*. No
driver is required for this device. Native support is provided by the operating
system.
Red Hat Linux 7.2, Linux 7.3 and Red Hat Enterprise Linux 3
* Certain Windows Vista product features require advanced or additional
hardware. Windows Vista Upgrade Advisor can help you determine which
features of Windows Vista will run on your computer. To download the tool,
visit:
system requirements, visit:
Management capabilities
WOL , PXE, DMI, WFM 2.0
Intel PRO/1000 PT
Gigabit PCIe Controller
Connector
RJ-45
Controller
Intel 82572EI Gigabit Ethernet Controller
Memory
Integrated Dual 48K configurable transmit receive FIFO Buffers
Data rates supported
10/100/1000 Mbps
Compliance
IEEE 802.1P, 802,1Q, 802.2, 802.3, 802.3AB and 802.3u compliant,
802.3x flow control
Bus architecture
PCI Express 1.0a
Data transfer mode
Bus-master DMA
Hardware certificationsFCC, B, CE, TUV- cTUVus Mark Canada and United States, TUV- GS Mark
for European Union
Power requirement
Aux 3.3V, 3.0 Watts in 1000base-T and 2.0 Watts in 100Base-T
Boot ROM support
Yes
Network transfer rate 10BASE-T (half-duplex) 10 Mbps
10BASE-T (full-duplex) 20 Mbps
100BASE-TX (half-duplex) 100 Mbps
100BASE-TX (full-duplex) 200 Mbps
1000BASE-T (full-duplex) 2000 Mbps (actual rate limited by PCI Bus)
Environmental
Operating temperature 32° to 131°F (0° to 55° C)
Operating humidity
85% at 131° F (55° C)
Dimensions
6.4 x 2.6 x 0.8 in (16.3 x 6.6 x 1.9 cm)
Management capabilities
ASF, WOL, PXE, DMI, WFM 2.0. (Wake-on-LAN supported from S1, S3,
S4 only. Not supported from S5)
QuickSpecs
HP Compaq dx2390 Microtower Business PC
(EMEA, APJ, and Brazil Only)
Technical Specifications - Communications
DA - 12990 Worldwide QuickSpecs — Version 8 — 4/3/2009
Page 20