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HP 1103 User Manual

Page 73

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4.

Remove the fan/heat sink assembly (4).

NOTE:

Due to the adhesive quality of the thermal material located between the fan/heat sink

assembly and system board components, it may be necessary to move the fan/heat sink
assembly from side to side to detach it from the system board.

NOTE:

The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink

assembly and the system board each time the fan/heat sink assembly is removed: Thermal
paste is used on the processor (1) and the fan/heat sink assembly section (2) that services it.

Reverse this procedure to install the fan/heat sink assembly.

Component replacement procedures

65