HP 1103 User Manual
Page 73
4.
Remove the fan/heat sink assembly (4).
NOTE:
Due to the adhesive quality of the thermal material located between the fan/heat sink
assembly and system board components, it may be necessary to move the fan/heat sink
assembly from side to side to detach it from the system board.
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink
assembly and the system board each time the fan/heat sink assembly is removed: Thermal
paste is used on the processor (1) and the fan/heat sink assembly section (2) that services it.
Reverse this procedure to install the fan/heat sink assembly.
Component replacement procedures
65
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