Echelon FT 5000 EVB - Manual (Page 35)

FT 5000 EVB Hardware Guide 27
Design and Test for Electromagnetic Compatibility
Echelon’s free topology twisted pair technologies support the creation of products that meet a wide
variety of regulatory requirements. Chapter 4 of the FT 5000 Smart Transceiver Data Book describes
how to create products with Echelon’s free topology twisted pair technology that meet electromagnetic
compatibility regulations.
The FT 5000 EVB boards are designed to facilitate testing of Echelon’s free topology twisted pair
technologies. As such, they have no enclosure, providing open access to the IO connectors, buttons,
LEDs, and other I/O components. They have been developed to allow consumer and commercial
device OEM suppliers to evaluate the technology quickly, and have not been designed to be installed
permanently
in homes or commercial buildings. If you work with the FT 5000 EVB boards in a home
environment, operation of other electronic equipment that is sensitive to RF radiated emissions, such as
televisions or radios, might be temporarily impaired during the evaluation period.
The standards for RF emissions vary by geographic region. To determine which standards apply in
your region, consult the appropriate regulatory agencies. In the European Union, CISPR 22 (or
equivalently, EN 55022) applies. In the North American market, the FCC regulates emissions from
unintentional radiators under 47CFR15.109, Subpart B, which allows for substitution of CISPR 22.
The FT 5000 EVB boards comply with CISPR 22 Level A, but not Level B (which is required for
deployment in home and commercial environments).