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Ordering information, Package diagram, Cy2309nz – Cypress Nine-Output 3.3V Buffer CY2309NZ User Manual

Page 4: 1 μf v, Clk out c, Test circuits

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CY2309NZ

Document #: 38-07182 Rev. *E

Page 4 of 6

Package Diagram

Figure 6. 16-Pin (150-Mil) SOIC S16

Ordering Information

Ordering Code

Package Type

Operating Range

CY2309NZSC–1H

[4]

16-pin 150-mil SOIC

Commercial

CY2309NZSC–1HT

[4]

16-pin 150-mil SOIC – Tape and Reel

Commercial

Pb-free

CY2309NZSXC–1H

16-pin 150-mil SOIC

Commercial

CY2309NZSXC–1HT

16-pin 150-mil SOIC – Tape and Reel

Commercial

CY2309NZSXI-1H

16-pin 150-mil SOIC

Industrial

CY2309NZSXI-1HT

16-pin 150-mil SOIC – Tape and Reel

Industrial

0.1

μF

V

DD

0.1

μF

V

DD

CLK out

C

LOAD

OUTPUTS

GND

GND

Test Circuits

PIN 1 ID

0°~8°

16 Lead (150 Mil) SOIC

1

8

9

16

SEATING PLANE

0.230[5.842]

0.244[6.197]

0.157[3.987]

0.150[3.810]

0.386[9.804]

0.393[9.982]

0.050[1.270]

BSC

0.061[1.549]

0.068[1.727]

0.004[0.102]

0.0098[0.249]

0.0138[0.350]

0.0192[0.487]

0.016[0.406]

0.035[0.889]

0.0075[0.190]

0.0098[0.249]

DIMENSIONS IN INCHES[MM] MIN.

MAX.

0.016[0.406]

0.010[0.254]

X 45°

0.004[0.102]

REFERENCE JEDEC MS-012

PART #

S16.15 STANDARD PKG.

SZ16.15 LEAD FREE PKG.

PACKAGE WEIGHT 0.15gms

51-85068-*B

Note

4. Not recommended for new designs.

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