Capacitance, Thermal resistance, Ac test loads and waveforms – Cypress Perform CY7C1354C User Manual
Page 18
CY7C1354C
CY7C1356C
Document #: 38-05538 Rev. *G
Page 18 of 28
Capacitance
[16]
Parameter
Description
Test Conditions
100 TQFP
Max.
119 BGA
Max.
165 FBGA
Max.
Unit
C
IN
Input
Capacitance
T
A
= 25
°C, f = 1 MHz,
V
DD
= 3.3V V
DDQ
= 2.5V
5
5
5
pF
C
CLK
Clock Input Capacitance
5
5
5
pF
C
I/O
Input/Output Capacitance
5
7
7
pF
Thermal Resistance
[16]
Parameter
Description
Test Conditions
100 TQFP
Max.
119 BGA
Max.
165 FBGA
Max.
Unit
Θ
JA
Thermal Resistance
(Junction to Ambient)
Test conditions follow standard
test methods and procedures for
measuring thermal impedance,
per EIA/JESD51.
29.41
34.1
16.8
°C/W
Θ
JC
Thermal Resistance
(Junction to Case)
6.13
14.0
3.0
°C/W
AC Test Loads and Waveforms
OUTPUT
R = 317
Ω
R = 351
Ω
5 pF
INCLUDING
JIG AND
SCOPE
(a)
(b)
OUTPUT
R
L
= 50
Ω
Z
0
= 50
Ω
V
T
= 1.5V
3.3V
ALL INPUT PULSES
V
DDQ
GND
90%
10%
90%
10%
≤ 1 ns
≤ 1 ns
(c)
OUTPUT
R = 1667
Ω
R = 1538
Ω
5 pF
INCLUDING
JIG AND
SCOPE
(a)
(b)
OUTPUT
R
L
= 50
Ω
Z
0
= 50
Ω
V
T
= 1.25V
2.5V
ALL INPUT PULSES
V
DDQ
GND
90%
10%
90%
10%
≤ 1 ns
≤ 1 ns
(c)
3.3V I/O Test Load
2.5V I/O Test Load