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Stk15c88, Package diagrams – Cypress STK15C88 User Manual

Page 13

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STK15C88

Document Number: 001-50593 Rev. **

Page 13 of 15

Package Diagrams

Figure 11. 28-Pin (300 mil) SOIC (51-85026)

51 85127 *A

PIN 1 ID

0.291[7.39]

0.300[7.62]

0.394[10.01]

0.419[10.64]

0.050[1.27]

TYP.

0.092[2.33]

0.105[2.67]

0.004[0.10]

0.0118[0.30]

SEATING PLANE

0.0091[0.23]

0.0125[3.17]

0.015[0.38]

0.050[1.27]

0.013[0.33]

0.019[0.48]

0.026[0.66]

0.032[0.81]

0.697[17.70]

0.713[18.11]

0.004[0.10]

1

14

15

28

*

*

*

PART #

S28.3 STANDARD PKG.

SZ28.3 LEAD FREE PKG.

MIN.
MAX.

NOTE :

1. JEDEC STD REF MO-119

2. BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH,BUT

MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.010 in (0.254 mm) PER SIDE

3. DIMENSIONS IN INCHES

4. PACKAGE WEIGHT 0.85gms

DOES INCLUDE MOLD MISMATCH AND ARE MEASURED AT THE MOLD PARTING LINE.

51-85026-*D

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