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Package diagram, Feedback – Cypress CY7C1316CV18 User Manual

Page 28

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CY7C1316CV18, CY7C1916CV18
CY7C1318CV18, CY7C1320CV18

Document Number: 001-07160 Rev. *E

Page 28 of 29

Package Diagram

Figure 6. 165-Ball FBGA (13 x 15 x 1.4 mm), 51-85180

A

1

PIN 1 CORNER

15.00±0.10

13.00±0.10

7.00

1.00

Ø0.50 (165X)

Ø0.25 M C A B

Ø0.05 M C

B

A

0.15(4X)

0.35±0.06

SEATING PLANE

0.53±0.05

0.25

C

0.15

C

PIN 1 CORNER

TOP VIEW

BOTTOM VIEW

2

3

4

5

6

7

8

9

10

10.00

14.00

B

C

D

E

F

G

H

J

K

L

M

N

11

11

10

9

8

6

7

5

4

3

2

1

P

R

P

R

K

M

N

L

J

H

G

F

E

D

C

B

A

A

15.00±0.10

13.00±0.10

B

C

1.00

5.00

0.36

-0.06
+0.14

1.40

MAX.

SOLDER PAD TYPE : NON-SOLDER MASK DEFINED (NSMD)

NOTES :

PACKAGE WEIGHT : 0.475g

JEDEC REFERENCE : MO-216 / DESIGN 4.6C

PACKAGE CODE : BB0AC

51-85180-*A

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