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Capacitance, Thermal resistance, Ac test loads and waveforms – Cypress CY7C1386D User Manual

Page 19

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CY7C1386D, CY7C1386F

CY7C1387D, CY7C1387F

Document Number: 38-05545 Rev. *E

Page 19 of 30

Capacitance

[19]

Parameter

Description

Test Conditions

100 TQFP

Max.

119 BGA

Max

165 FBGA

Max

Unit

C

IN

Input Capacitance

T

A

= 25

°C, f = 1 MHz,

V

DD

= 3.3V

V

DDQ

= 2.5V

5

8

9

pF

C

CLK

Clock Input Capacitance

5

8

9

pF

C

IO

Input/Output Capacitance

5

8

9

pF

Thermal Resistance

[19]

Parameter

Description

Test Conditions

100 TQFP

Package

119 BGA

Package

165 FBGA

Package

Unit

Θ

JA

Thermal Resistance

(Junction to Ambient)

Test conditions follow standard

test methods and procedures

for measuring thermal

impedance, in accordance with

EIA/JESD51.

28.66

23.8

20.7

°C/W

Θ

JC

Thermal Resistance

(Junction to Case)

4.08

6.2

4.0

°C/W

AC Test Loads and Waveforms

OUTPUT

R = 317

R = 351

5 pF

INCLUDING

JIG AND

SCOPE

(a)

(b)

OUTPUT

R

L

= 50

Z

0

= 50

V

T

= 1.5V

3.3V

ALL INPUT PULSES

V

DDQ

GND

90%

10%

90%

10%

≤ 1 ns

≤ 1 ns

(c)

OUTPUT

R = 1667

R = 1538

5 pF

INCLUDING

JIG AND

SCOPE

(a)

(b)

OUTPUT

R

L

= 50

Z

0

= 50

V

T

= 1.25V

2.5V

ALL INPUT PULSES

V

DDQ

GND

90%

10%

90%

10%

≤ 1 ns

≤ 1 ns

(c)

3.3V IO Test Load

2.5V IO Test Load

Note

19. Tested initially and after any design or process change that may affect these parameters.

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