Metrohm NIRS XDS Process Analyzer – MicroBundle - Manual (Page 6)

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Table of contents
1 Introduction ................................................................................................................... 6
1.1 Enclosure Styles ........................................................................................... 6
1.2 Fiber Optic Probe Ends ................................................................................. 8
1.3 MicroBundle Fiber Information .................................................................... 9
1.4 XDS Process Options .................................................................................... 9
2 Purged System for Hazardous Environments ............................................................... 11
2.1 Pressurization “Types” ............................................................................... 11
2.2 Class, Group and Division Ratings .............................................................. 12
2.3 Display / Interface Module: ........................................................................ 13
2.4 Power-up Instructions: ............................................................................... 14
2.5 Definition of Terms: ................................................................................... 18
3 Instrument Specifications ............................................................................................ 20
3.1 Enclosure Options for Specific Environments ............................................. 20
3.2 Dimensions ................................................................................................. 20
3.3 Weight ....................................................................................................... 21
3.4 Operating Temperature Range ................................................................... 21
3.5 Operating Humidity Range ......................................................................... 21
3.6 Power Requirements .................................................................................. 21
3.6.1 Terminology ......................................................................................................... 22
3.7 I/O Connection ........................................................................................... 22
3.8 Scan Range ................................................................................................ 22
3.9 Data Interval .............................................................................................. 22
3.10 Clock/ Oscillator Frequencies ...................................................................... 22
3.11 Power Supply Voltages .............................................................................. 23
3.12 Resistive Heater in Basic System and Vortec Cooled Systems ..................... 23
3.13 Air Conditioner Type .................................................................................. 23
3.14 Lamp Source in XDS Process Analytics Instrument ..................................... 23
4 Site Requirements ........................................................................................................ 24
5 Installation of Process Enclosure ................................................................................. 26
5.1 Basic NEMA 4X Process Analytics Instrument ............................................ 26
5.2 Vortec Cooled XDS Process Analytics Instrument ....................................... 28
5.3 Purged Enclosure for Hazardous Environments .......................................... 29
5.4 Mounting of XDS Process Enclosure ........................................................... 30
5.5 Removal of Shipping Restraints .................................................................. 33
6 Installation of Fiber Optics ........................................................................................... 34
7 Electrical Connection ................................................................................................... 36
7.1 Basic NEMA 4X Enclosure .......................................................................... 36
7.2 Purged Unit ................................................................................................ 36
7.3 AC Power Switch Settings .......................................................................... 40
8 RJ-45 Network Connection .......................................................................................... 42
8.1 Basic Process Instrument RJ-45 Connection ............................................... 42