Rockwell Automation T8300 Trusted Expander Chassis - Manual

SDS-8300
Trusted
TM Industrial Control System
Trusted TM Expander Chassis-T8300
Issue 5 Jan 2006
FRONT PANEL
DESCRIPTION
The Trusted
TM Expander Chassis
houses the Trusted TM Expander
Processor(s) and up to twelve I/O
modules from the High Integrity
(T84XX) range.
The chassis consists of a
backplane,
power connection
terminals, and the Inter-Module
Bus connectors. The chassis is
6U (10.5ins) high and is either
front mounted in a 483mm (19-
inch) fixed frame or swingframe,
or can be panel (rear) mounted in
a suitable electrical enclosure.
The two slot positions on the left
(as viewed from the front) are for
installing the Trusted
TM Expander
Processors. The twelve
remaining slots are for installing
I/O modules. Each module plugs
into the chassis backplane,
connecting to the triplicated Inter-
Module Bus. Double and single
connector options are available.
The backplane is part of the
Trusted
TM Expander Chassis and
provides electrical interconnection
and other services for the
modules. A triplicated 4-position
DIP switch is provided for user
configuration of the system
identification..
Power connection to the
Trusted TM Expander Chassis is
provided via a 4-pole connector
on the chassis backplate. The
Trusted
TM Expander Chassis is
designed for a nominal dual +24V
dc power supply.
FEATURES
Up to two Trusted TM
Expander Processors
supported per Trusted
TM
Expander Chassis
Up to twelve High Integrity
I/O modules supported per
Trusted
TM Expander
Chassis
Dual redundant power
supplies from the Trusted
TM
High Integrity Power Supply
Unit
Module slot keying
Triplicated Inter-Module
Bus connections
Front or rear (panel)
mounting on 483mm (19-
inch) dimensions
32,48,64 and 96-way
DIN41612 I/O port
connector capability