Package dimensions, Thermal characteristics, 16l tssop (4.4 mm body) package drawing – Cirrus Logic CS5340 User Manual
Page 21
DS601F2
21
CS5340
Confidential Draft
3/11/08
6. PACKAGE DIMENSIONS
1.
“D” and “E1” are reference datums and do not included mold flash or protrusions, but do include mold
mismatch and are measured at the parting line, mold flash or protrusions shall not exceed 0.20 mm per
side.
2.
Dimension “b” does not include dambar protrusion/intrusion. Allowable dambar protrusion shall be
0.13 mm total in excess of “b” dimension at maximum material condition. Dambar intrusion shall not re-
duce dimension “b” by more than 0.07 mm at least material condition.
3.
These dimensions apply to the flat section of the lead between 0.10 and 0.25 mm from lead tips.
THERMAL CHARACTERISTICS
INCHES
MILLIMETERS
NOTE
DIM
MIN
NOM
MAX
MIN
NOM
MAX
A
--
--
0.043
--
--
1.10
A1
0.002
0.004
0.006
0.05
--
0.15
A2
0.03346
0.0354
0.037
0.85
0.90
0.95
b
0.00748
0.0096
0.012
0.19
0.245
0.30
D
0.193
0.1969
0.201
4.90
5.00
5.10
E
0.248
0.2519
0.256
6.30
6.40
6.50
E1
0.169
0.1732
0.177
4.30
4.40
4.50
e
--
0.026 BSC
--
--
0.65 BSC
--
L
0.020
0.024
0.028
0.50
0.60
0.70
µ
0°
4°
8°
0°
4°
8°
JEDEC #: MO-153
Controlling Dimension is Millimeters
Parameter
Symbol
Min
Typ
Max
Unit
Allowable Junction Temperature
-
-
135
°C
Junction to Ambient Thermal Impedance
θ
JA
-
75
-
°C/W
16L TSSOP (4.4 mm BODY) PACKAGE DRAWING
E
N
1 2 3
e
b
2
A1
A2
A
D
SEATING
PLANE
E1
1
L
SIDE VIEW
END VIEW
TOP VIEW
∝