HP OneView for Red Hat Enterprise Virtualization User Manual
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Output Power—The amount of power in Watts that the subsystem is producing.
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Power Consumed—The current power consumed by the subsystem.
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Good Power Supplies—The number of power supplies that are currently operating in the
subsystem.
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Wanted Power Supplies—The needed number of power supplies plus the redundant number
of power supplies in the subsystem.
•
Needed Power Supplies—The number of power supplies needed for the subsystem to work
properly.
Thermal Information
The Thermal Information data table contains:
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Redundancy—The status of thermal subsystem redundancy: either in a redundant configuration,
not in a redundant configuration, or status unknown.
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Ambient Temperature—The temperature inside the enclosure.
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Good Fans—The number of fans currently operating in the enclosure.
•
Wanted Fans—The needed number of fans plus the redundant number of fans.
•
Needed Fans—Number of fans required for the subsystem not to overheat.
Fan Information
The Fan Information table contains, for each fan bay:
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Bay—The location of the fan.
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Status—The current status of the fan.
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Name—The HP product name of the fan.
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Speed—Fan speed for thermal management of server.
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Power—The amount of power currently being consumed by the fan.
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Part Number—The HP fan part number.
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Spare Part Number—The HP fan spare part number.
Power Supplies
The Power Supplies table contains, for each power supply bay:
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Bay—The location of the power supply.
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Status—The current status of the power supply.
•
Name—The HP product name of the power supply.
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Power—The amount of power currently supplied and the total amount of power that can be
supplied.
•
Serial Number—The HP serial number for the power supply.
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Part Number—The HP part number for the power supply.
•
Spare Part Number—The HP spare part number for the power supply.
Interconnect trays
The Interconnect Trays table contains, for each interconnect bay:
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Bay—The number of the bay containing the interconnect tray.
•
Status—The current status of the enclosure tray.
•
Name—The HP product name of the interconnect module.
•
Power—The amount of power currently being used by the interconnect module.
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Viewing inventory, performance, and health data for HP ProLiant host servers