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Maximum ratings n-channel – q1, Maximum ratings p-channel – q2, Thermal characteristics – Diodes DMC3021LK4 User Manual

Page 2

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DMC3021LK4

Document number: DS35082 Rev. 5 - 2

2 of 10

www.diodes.com

April 2014

© Diodes Incorporated

DMC3021LK4

NEW PROD

UC

T




Maximum Ratings N-CHANNEL – Q1

(@T

A

= +25°C, unless otherwise specified.)

Characteristic Symbol

Value

Units

Drain-Source Voltage

V

DSS

30 V

Gate-Source Voltage

V

GSS

±20 V

Continuous Drain Current (Note 6) V

GS

= 10V

Steady

State

T

A

= +25°C

T

A

= +70°C

I

D

9.4
7.5

A

Continuous Drain Current (Note 6) V

GS

= 10V

Steady

State

T

C

= +25°C

T

C

= +70°C

I

D

14
14

A

Pulsed Drain Current (10µs Pulse, Duty Cycle = 1%)

I

DM

70 A

Avalanche Current, (Notes 7) L = 0.1mH

I

AS

16 A

Avalanche Energy, (Notes 7) L = 0.1mH

E

AS

13 mJ




Maximum Ratings P-CHANNEL – Q2

(@T

A

= +25°C, unless otherwise specified.)

Characteristic Symbol

Value

Units

Drain-Source Voltage

V

DSS

-30 V

Gate-Source Voltage

V

GSS

±20 V

Continuous Drain Current (Note 6) V

GS

= -10V

Steady

State

T

A

= +25°C

T

A

= +70°C

I

D

-6.8
-5.3

A

Continuous Drain Current (Note 6) V

GS

= -10V

Steady

State

T

C

= +25°C

T

C

= +70°C

I

D

-14
-14

A

Pulsed Drain Current (10µs Pulse, Duty Cycle = 1%)

I

DM

-50 A

Avalanche Current, (Notes 7) L = 0.1mH

I

AS

-16 A

Avalanche Energy, (Notes 7) L = 0.1mH

E

AS

13 mJ




Thermal Characteristics

(@T

A

= +25°C, unless otherwise specified.)

Characteristic Symbol

Value

Units

Total Power Dissipation (Note 6)

T

A

= +25°C

P

D

2.7

W

T

A

= +70°C

1.7

Total Power Dissipation (Note 6)

T

C

= +25°C

22

T

C

= +70°C

14

Thermal Resistance, Junction to Ambient (Note 6)

Steady state

R

θJA

46

°C/W

Thermal Resistance, Junction to Case (Note 6)

Steady state

R

θJC

5.5

Operating and Storage Temperature Range

T

J,

T

STG

-55 to +150

°C

Notes:

5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1inch square copper plate
7. I

AS

and E

AS

rating are based on low frequency and duty cycles to keep T

J

= 25°C

8. Short duration pulse test used to minimize self-heating effect.
9. Guaranteed by design. Not subject to product testing.