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Electrical characteristics q1 n-channel, Electrical characteristics q2 p-channel, Dmc1229ufdb – Diodes DMC1229UFDB User Manual

Page 3

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DMC1229UFDB

Document number: DS36128 Rev. 4 - 2

3 of 9

www.diodes.com

September 2013

© Diodes Incorporated

DMC1229UFDB



Electrical Characteristics Q1 N-CHANNEL

(@T

A

= +25°C, unless otherwise specified.)

Characteristic

Symbol

Min

Typ

Max

Unit

Test Condition

OFF CHARACTERISTICS (Note 6)
Drain-Source Breakdown Voltage

BV

DSS

12

— V

V

GS

= 0V, I

D

= 250μA

Zero Gate Voltage Drain Current T

J

= +25°C

I

DSS

— — 1.0

μA

V

DS

= 12V, V

GS

= 0V

Gate-Source Leakage

I

GSS

— —

±100 nA

V

GS

= ±8V, V

DS

= 0V

ON CHARACTERISTICS (Note 6)
Gate Threshold Voltage

V

GS(th)

0.4 — 1 V

V

DS

= V

GS

, I

D

= 250μA

Static Drain-Source On-Resistance

R

DS (ON)

17 29

mΩ

V

GS

= 4.5V, I

D

= 5A

20 34

V

GS

= 2.5V, I

D

= 4.6A

24 44

V

GS

= 1.8V, I

D

= 4.1A

30 65

V

GS

= 1.5V, I

D

= 2A

Forward Transfer Admittance

|Y

fs

|

6.5 — S

V

DS

= 10V, I

D

= 5A

Diode Forward Voltage

V

SD

0.6 1.2 V

V

GS

= 0V, I

S

= 1A

DYNAMIC CHARACTERISTICS (Note 7)
Input Capacitance

C

iss

— 914

pF

V

DS

= 6V, V

GS

= 0V,

f = 1.0MHz

Output Capacitance

C

oss

— 132

pF

Reverse Transfer Capacitance

C

rss

— 119

pF

Gate Resistance

R

g

— 1.26

V

DS

= 0V, V

GS

= 0V, f = 1MHz

Total Gate Charge (V

GS

= 4.5V)

Q

g

— 10.5

nC

V

DS

= 6V, I

D

= 6.5A

Total Gate Charge (V

GS

= 8V)

— 19.6 — nC

Gate-Source Charge

Q

gs

— 1.2

nC

Gate-Drain Charge

Q

gd

— 1.6

nC

Turn-On Delay Time

t

D(on)

— 5.0

ns

V

DD

= 6V, V

GS

= 4.5V,

R

L

= 1.2Ω, R

G

= 1Ω

Turn-On Rise Time

t

r

— 10.5

ns

Turn-Off Delay Time

t

D(off)

— 16.6

ns

Turn-Off Fall Time

t

f

— 4.1

ns


Electrical Characteristics Q2 P-CHANNEL

(@T

A

= +25°C, unless otherwise specified.)

Characteristic

Symbol

Min

Typ

Max

Unit

Test Condition

OFF CHARACTERISTICS (Note 6)
Drain-Source Breakdown Voltage

BV

DSS

-12 — — V

V

GS

= 0V, I

D

= -250μA

Zero Gate Voltage Drain Current T

J

= +25°C

I

DSS

— — -1.0

μA

V

DS

= -12V, V

GS

= 0V

Gate-Source Leakage

I

GSS

— —

±100 nA

V

GS

= ±8V, V

DS

= 0V

ON CHARACTERISTICS (Note 6)
Gate Threshold Voltage

V

GS(th)

-0.4 — -1 V

V

DS

= V

GS

, I

D

= -250μA

Static Drain-Source On-Resistance

R

DS (ON)

37 61

mΩ

V

GS

= -4.5V, I

D

= -3.6A

47 81

V

GS

= -2.5V, I

D

= -3.2A

63 115

V

GS

= -1.8V, I

D

= -1A

90 170

V

GS

= -1.5V, I

D

= -1A

Forward Transfer Admittance

|Y

fs

|

5.5 — S

V

DS

= -10V, I

D

= -3.6A

Diode Forward Voltage

V

SD

-0.65 -1.2 V V

GS

= 0V, I

S

= -1A

DYNAMIC CHARACTERISTICS (Note 7)
Input Capacitance

C

iss

— 915

pF

V

DS

= -6V, V

GS

= 0V,

f = 1.0MHz

Output Capacitance

C

oss

— 225

pF

Reverse Transfer Capacitance

C

rss

— 183

pF

Gate Resistance

R

g

— 56.9

V

DS

= 0V, V

GS

= 0V, f = 1MHz

Total Gate Charge (V

GS

= -4.5V)

Q

g

— 10.7

nC

V

DS

= -6V, I

D

= -4.3A

Total Gate Charge (V

GS

= -8V)

— 17.9 — nC

Gate-Source Charge

Q

gs

— 1.7

nC

Gate-Drain Charge

Q

gd

— 3.0

nC

Turn-On Delay Time

t

D(on)

— 5.7

ns

V

DD

= -6V, V

GS

= -4.5V,

R

L

= 1.6Ω, R

G

= 1Ω

Turn-On Rise Time

t

r

— 11.5

ns

Turn-Off Delay Time

t

D(off)

— 27.8

ns

Turn-Off Fall Time

t

f

— 26.4

ns

Notes:

6. Short duration pulse test used to minimize self-heating effect.
7. Guaranteed by design. Not subject to product testing.