Electrical characteristics q1 n-channel, Electrical characteristics q2 p-channel, Dmc1229ufdb – Diodes DMC1229UFDB User Manual
Page 3

DMC1229UFDB
Document number: DS36128 Rev. 4 - 2
3 of 9
September 2013
© Diodes Incorporated
DMC1229UFDB
Electrical Characteristics Q1 N-CHANNEL
(@T
A
= +25°C, unless otherwise specified.)
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
OFF CHARACTERISTICS (Note 6)
Drain-Source Breakdown Voltage
BV
DSS
12
—
— V
V
GS
= 0V, I
D
= 250μA
Zero Gate Voltage Drain Current T
J
= +25°C
I
DSS
— — 1.0
μA
V
DS
= 12V, V
GS
= 0V
Gate-Source Leakage
I
GSS
— —
±100 nA
V
GS
= ±8V, V
DS
= 0V
ON CHARACTERISTICS (Note 6)
Gate Threshold Voltage
V
GS(th)
0.4 — 1 V
V
DS
= V
GS
, I
D
= 250μA
Static Drain-Source On-Resistance
R
DS (ON)
—
17 29
mΩ
V
GS
= 4.5V, I
D
= 5A
—
20 34
V
GS
= 2.5V, I
D
= 4.6A
—
24 44
V
GS
= 1.8V, I
D
= 4.1A
—
30 65
V
GS
= 1.5V, I
D
= 2A
Forward Transfer Admittance
|Y
fs
|
—
6.5 — S
V
DS
= 10V, I
D
= 5A
Diode Forward Voltage
V
SD
—
0.6 1.2 V
V
GS
= 0V, I
S
= 1A
DYNAMIC CHARACTERISTICS (Note 7)
Input Capacitance
C
iss
— 914
—
pF
V
DS
= 6V, V
GS
= 0V,
f = 1.0MHz
Output Capacitance
C
oss
— 132
—
pF
Reverse Transfer Capacitance
C
rss
— 119
—
pF
Gate Resistance
R
g
— 1.26
—
Ω
V
DS
= 0V, V
GS
= 0V, f = 1MHz
Total Gate Charge (V
GS
= 4.5V)
Q
g
— 10.5
—
nC
V
DS
= 6V, I
D
= 6.5A
Total Gate Charge (V
GS
= 8V)
— 19.6 — nC
Gate-Source Charge
Q
gs
— 1.2
—
nC
Gate-Drain Charge
Q
gd
— 1.6
—
nC
Turn-On Delay Time
t
D(on)
— 5.0
—
ns
V
DD
= 6V, V
GS
= 4.5V,
R
L
= 1.2Ω, R
G
= 1Ω
Turn-On Rise Time
t
r
— 10.5
—
ns
Turn-Off Delay Time
t
D(off)
— 16.6
—
ns
Turn-Off Fall Time
t
f
— 4.1
—
ns
Electrical Characteristics Q2 P-CHANNEL
(@T
A
= +25°C, unless otherwise specified.)
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
OFF CHARACTERISTICS (Note 6)
Drain-Source Breakdown Voltage
BV
DSS
-12 — — V
V
GS
= 0V, I
D
= -250μA
Zero Gate Voltage Drain Current T
J
= +25°C
I
DSS
— — -1.0
μA
V
DS
= -12V, V
GS
= 0V
Gate-Source Leakage
I
GSS
— —
±100 nA
V
GS
= ±8V, V
DS
= 0V
ON CHARACTERISTICS (Note 6)
Gate Threshold Voltage
V
GS(th)
-0.4 — -1 V
V
DS
= V
GS
, I
D
= -250μA
Static Drain-Source On-Resistance
R
DS (ON)
—
37 61
mΩ
V
GS
= -4.5V, I
D
= -3.6A
—
47 81
V
GS
= -2.5V, I
D
= -3.2A
—
63 115
V
GS
= -1.8V, I
D
= -1A
—
90 170
V
GS
= -1.5V, I
D
= -1A
Forward Transfer Admittance
|Y
fs
|
—
5.5 — S
V
DS
= -10V, I
D
= -3.6A
Diode Forward Voltage
V
SD
—
-0.65 -1.2 V V
GS
= 0V, I
S
= -1A
DYNAMIC CHARACTERISTICS (Note 7)
Input Capacitance
C
iss
— 915
—
pF
V
DS
= -6V, V
GS
= 0V,
f = 1.0MHz
Output Capacitance
C
oss
— 225
—
pF
Reverse Transfer Capacitance
C
rss
— 183
—
pF
Gate Resistance
R
g
— 56.9
—
Ω
V
DS
= 0V, V
GS
= 0V, f = 1MHz
Total Gate Charge (V
GS
= -4.5V)
Q
g
— 10.7
—
nC
V
DS
= -6V, I
D
= -4.3A
Total Gate Charge (V
GS
= -8V)
— 17.9 — nC
Gate-Source Charge
Q
gs
— 1.7
—
nC
Gate-Drain Charge
Q
gd
— 3.0
—
nC
Turn-On Delay Time
t
D(on)
— 5.7
—
ns
V
DD
= -6V, V
GS
= -4.5V,
R
L
= 1.6Ω, R
G
= 1Ω
Turn-On Rise Time
t
r
— 11.5
—
ns
Turn-Off Delay Time
t
D(off)
— 27.8
—
ns
Turn-Off Fall Time
t
f
— 26.4
—
ns
Notes:
6. Short duration pulse test used to minimize self-heating effect.
7. Guaranteed by design. Not subject to product testing.