Diodes DMP32D9UFZ - Manual (Page 2)

DMP32D9UFZ
Document number: DS36842 Rev. 2 - 2
2 of 6
www.diodes.com
June 2014
© Diodes Incorporated
DMP32D9UFZ
NEW PROD
UC
T
NEW PROD
UC
T
Maximum Ratings
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Value Units
Drain-Source Voltage V
DSS
-30 V
Gate-Source Voltage V
GSS
±10 V
Continuous Drain Current (Note 5) V
GS
= -4.5V
Steady
State
T
A
= +25°C
T
A
= +70°C
I
D
-200
-100
mA
Pulsed Drain Current (Note 6) I
DM
-500 mA
Thermal Characteristics
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Value Units
Total Power Dissipation (Note 5) Steady State P
D
390 mW
Thermal Resistance, Junction to Ambient (Note 5) Steady State R
θJA
322 °C/W
Operating and Storage Temperature Range T
J,
T
STG
-55 to +150 °C
Electrical Characteristics
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
BV
DSS
-30 — — V V
GS
= 0V, I
D
= -250μA
Zero Gate Voltage Drain Current @T
C
= +25°C I
DSS
— — 100 nA V
DS
= -24V, V
GS
= 0V
Gate-Source Leakage I
GSS
— — ±10 µA V
GS
= ±10V, V
DS
= 0V
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
V
GS(th)
-0.4 — -1.0 V V
DS
= V
GS
, I
D
= -250μA
Static Drain-Source On-Resistance R
DS (ON)
— — 5
Ω
V
GS
= -4.5V, I
D
= -100mA
— — 6 V
GS
= -2.5V, I
D
= -50mA
— — 7 V
GS
= -1.8V, I
D
= -20mA
— — 10 V
GS
= -1.5V, I
D
= -10mA
— 6 — V
GS
= -1.2V, I
D
= -1mA
Diode Forward Voltage V
SD
— -0.75 -1.0 V V
GS
= 0V, I
S
= -10mA
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
C
iss
— 22.5 — pF
V
DS
= -15V, V
GS
= 0V,
f = 1.0MHz
Output Capacitance C
oss
— 2.9 — pF
Reverse Transfer Capacitance C
rss
— 2.1 — pF
Total Gate Charge Q
g
— 0.35 — nC
V
GS
= -4.5V, V
DS
=- 15V,
I
D
= -200mA
Gate-Source Charge Q
gs
— 0.06 — nC
Gate-Drain Charge Q
gd
— 0.09 — nC
Turn-On Delay Time t
D(on)
— 3.1 — ns
V
DD
= -10V, V
GS
= -4.5V,
R
G
= 6Ω, I
D
= -200mA
Turn-On Rise Time t
r
— 2.3 — ns
Turn-Off Delay Time t
D(off)
— 19.9 — ns
Turn-Off Fall Time t
f
— 10.5 — ns
Notes: 5. Device mounted on FR-4 PCB, with minimum recommended pad layout.
6. Device mounted on minimum recommended pad layout test board, 10μs pulse duty cycle = 1%.
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to product testing.