Package outline dimensions suggested pad layout – Diodes DMP2540UCB9 User Manual
Page 5
DMP2540UCB9
Document number: DS35611 Rev. 4 - 2
5 of 6
June 2012
© Diodes Incorporated
DMP2540UCB9
NEW PROD
UC
T
ADVAN
CE I
N
F
O
RM
ATI
O
N
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1,000
t1, PULSE DURATION TIMES (sec)
Fig. 13 Transient Thermal Resistance
0.001
0.01
0.1
r(
t),
T
R
A
N
SI
EN
T
T
H
E
R
MA
L
R
ES
IS
T
AN
C
E
1
R
(t) = r(t) * R
θ
θ
JA
JA
R
= 70°C/W
Duty Cycle, D = t1/ t2
θJA
D = 0.7
D = 0.9
D = 0.5
D = 0.3
D = 0.1
D = 0.05
D = 0.02
D = 0.01
D = 0.005
Single Pulse
Package Outline Dimensions
Suggested Pad Layout
U-WLB1515-9
Dim
Min
Max Typ
A
-
0.62 -
A2
- 0.36
0.36
A3
0.020 0.030 0.025
b
0.27 0.37 0.32
D
1.47
1.51 1.49
E
1.47
1.51 1.49
e
-
- 0.50
All Dimensions in mm
Dimensions
Value
(in mm)
C
0.50
C1
1.00
C2
1.00
D
0.25
D
E
PIN ID
e
e
6X-Ø b
e
A2
A
SEATING PLANE
A3
e
C
C1
C
D
C2
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