Dmn30h4d0l new prod uc t, Package outline dimensions, Suggested pad layout – Diodes DMN30H4D0L User Manual
Page 5

DMN30H4D0L
Document number: DS36313 Rev. 2 - 2
5 of 6
February 2014
© Diodes Incorporated
DMN30H4D0L
NEW PROD
UC
T
Package Outline Dimensions
Suggested Pad Layout
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1,000
t1, PULSE DURATION TIME (sec)
Figure 13 Transient Thermal Resistance
0.001
0.01
0.1
1
r(t),
T
R
A
N
SI
EN
T
T
H
E
R
MA
L
R
ES
IS
TAN
C
E
R
(t) = r(t) * R
R
= 160°C/W
Duty Cycle, D = t1/ t2
JA
JA
JA
D = 0.5
D = 0.7
D = 0.9
D = 0.3
D = 0.1
D = 0.05
D = 0.02
D = 0.01
D = 0.005
D = Single Pulse
SOT23
Dim Min Max Typ
A
0.37 0.51 0.40
B
1.20 1.40 1.30
C
2.30 2.50 2.40
D
0.89 1.03 0.915
F
0.45 0.60 0.535
G
1.78 2.05 1.83
H
2.80 3.00 2.90
J
0.013 0.10 0.05
K
0.903 1.10 1.00
K1
- -
0.400
L
0.45 0.61 0.55
M
0.085 0.18 0.11
0° 8° -
All Dimensions in mm
Dimensions Value (in mm)
Z
2.9
X
0.8
Y
0.9
C
2.0
E
1.35
A
M
J
L
D
F
B C
H
K
G
K1
X
E
Y
C
Z