Diodes DMG6898LSD - Manual (Page 2)

DMG6898LSD
Document number: DS31947 Rev. 4 - 2
2 of 6
www.diodes.com
March 2012
© Diodes Incorporated
DMG6898LSD
NEW PROD
UC
T
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Characteristic Symbol Value Unit
Drain-Source Voltage V DSS
20 V
Gate-Source Voltage V
GSS
±12 V
Continuous Drain Current (Note 4)
Steady
State
T
A
= 25°C
T
A
= 85°C
I
D
9.5
7.1
A
Pulsed Drain Current (Note 5) I
DM
30 A
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 4) P
D
1.28 W
Thermal Resistance, Junction to Ambient @T
A
= 25°C (Note 4) R θJA 99.3 °C/W
Operating and Storage Temperature Range T
J
, T
STG
-55 to +150 °C
Electrical Characteristics
@T
A
= 25°C unless otherwise specified
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 6)
Drain-Source Breakdown Voltage
BV
DSS
20 - - V V
GS
= 0V, I
D
= 250 μA
Zero Gate Voltage Drain Current T
J
= 25°C I
DSS
- - 1.0 μA V
DS
= 20V, V
GS
= 0V
Gate-Source Leakage I
GSS
- - ±10 μA V
GS
= ±12V, V
DS
= 0V
ON CHARACTERISTICS (Note 6)
Gate Threshold Voltage
V
GS(th)
0.5 1.0 1.5 V V
DS
= V
GS
, I
D
= 250 μA
Static Drain-Source On-Resistance R
DS (ON)
-
11
17 16
23
m Ω
V
GS
= 4.5V, I
D
= 9.4A
V
GS
= 2.5V, I
D
= 8.3A
Forward Transfer Admittance |Y
fs
| - 17 - S V
DS
= 5V, I
D
= 9.4A
Diode Forward Voltage V
SD
- 0.7 1.2 V V
GS
= 0V, I
S
= 1.3A
DYNAMIC CHARACTERISTICS (Note 7)
Input Capacitance
C
iss
- 1149 - pF
V
DS
= 10V, V
GS
= 0V,
f = 1.0MHz
Output Capacitance C
oss
- 157 - pF
Reverse Transfer Capacitance C
rss
- 142 - pF
Gate Resistance R g
- 1.51 - Ω V DS = 0V, V GS = 0V, f = 1MHz
Total Gate Charge (V
GS
= 4.5V) Q
g
- 11.6 - nC
V
GS
= 4.5V, V
DS
= 10V,
I
D
= 9.4A
Total Gate Charge (V
GS
= 10V) Q
g
- 26 - nC
Gate-Source Charge Q gs
- 2.7 - nC
Gate-Drain Charge Q
gd
- 3.4 - nC
Turn-On Delay Time t
D(on)
- 11.67 - ns
V
DD
= 10V, V
GS
= 4.5V,
R
GEN
= 6 Ω, I
D
= 1A
Turn-On Rise Time t
r
- 12.49 - ns
Turn-Off Delay Time t
D(off)
- 35.89 - ns
Turn-Off Fall Time t
f
- 12.33 - ns
Notes: 4. Device mounted on FR-4 PCB, with minimum recommended pad layout.
5. Repetitive rating, pulse width limited by junction temperature.
6. Short duration pulse test used to minimize self-heating effect.
7. Guaranteed by design. Not subject to production testing.