Package outline dimensions, Suggested pad layout, Dmg5802lfx – Diodes DMG5802LFX User Manual
Page 5
DMG5802LFX
Document number: DS35009 Rev. 5 - 2
5 of 6
November 2013
© Diodes Incorporated
DMG5802LFX
Package Outline Dimensions
Suggested Pad Layout
0.001
0.01
0.1
1
10
100
1,000
Fig. 13 Transient Thermal Response
t , PULSE DURATION TIME (s)
1
0.00001
0.0001
0.001
0.01
0.1
1
r(t
),
T
R
ANS
IEN
T
T
H
E
R
MA
L
R
ES
IS
TAN
C
E
T - T = P * R
(t)
Duty Cycle, D = t /t
J
A
JA
1 2
R
(t) = r(t) *
JA
R
R
= 122°C/W
JA
JA
P(pk)
t
1
t
2
D = 0.7
D = 0.3
D = 0.1
D = 0.05
D = 0.02
D = 0.01
D = 0.005
D = Single Pulse
D = 0.9
D = 0.5
W-DFN5020-6
Dim
Min
Max Typ
A
0.75
0.85 0.80
A1
0 0.05
0.02
A3
0.15
b
0.20
0.30 0.25
D
1.90
2.10 2.00
D2
1.40 1.60 1.50
e
0.50
E
4.90 5.10 5.00
E2
2.80 3.00 2.90
L
0.35 0.65 0.50
Z
0.375
All Dimensions in mm
Dimensions Value (in mm)
C
0.50
G
0.35
X
0.35
X1
0.90
X2
1.80
Y
0.70
Y2
1.60
Y3
3.20
e
D
A3
A1
A
E
D2
E2
L
Z
b
Pin 1 ID
Y3
X2
X1
Y2
X
C
Y
G