Diodes AP3154A - Manual (Page 5)

AP3154A
120mA HIGH EFFICIENCY WHITE LED DRIVER
AP3154A Rev. 1 5 of 14 AUGUST 2009
www.diodes.com © Diodes Incorporated
Electrical Characteristics
C
IN
= C
OUT
= C1 = C2 = 1.0µF; T
A
= 25°C, V
IN
= 3.5V. Unless otherwise stated.
Symbol Description Conditions Min Typ. Max Units
I
Q
Quiescent Current
1X Mode
Fosc=1.2MHz,
SDI=HIGH, no load
1.2 mA
I
SHDN
Shutdown Current SDI = 0 0.3 6 µA
I
DX
I
SINK
Current Accuracy
(Note 4)
I
SINK
= 20mA -10 10 %
I
D-Match
Current Matching
(Note 5) V
F
: D1=D2=D3=D4
I
D
= 2, 20mA
5 %
T
SS
Soft-start Time 1 ms
F
CLK
Switching Clock Frequency 0.6/1.2/1.8 MHz
F
SSP
Spread Spectrum Enabled +10 %
V
SDI(L)
SDI Threshold Low V
IN
= 2.7V to 5.5V 0.4 V
V
SDI(H)
SDI Threshold High V
IN
= 2.7V to 5.5V 1.6 V
T
SLO
SDI Low Time 0.05 50 µs
T
SHI
SDI High Time 0.05 50 µs
f
PWM
PWM Frequency (Range 1) 0.2 1.5 KHz
PWM Frequency (Range 2) 20 30 KHz
T
PWM
PWM Signal Period
1/
f
PWM
-Max
1/ f
PWM
-Min µs
T
PLO
PWM Signal Low (LED off) 1 T
PWM
– 1 µs
T
PHI
PWM Signal High (LED on) 1 T
PWM
– 1 µs
T
OFF
Chip Disable (held low)
PWM 65 100 ms
No PWM 512 800 µs
T
SEP
Interval between SDI
sequences (held high) PWM 65 100 ms
No PWM 512 800 µs
I
SDI
SDI Input Leakage -1 1 µA
I
SCP
V
OUT
Short to GND hold
Current
500 mA
θ
JA
Thermal Resistance1 –
Junction to Ambient DFN3030-12
(Note 6)
160 °C/W
θ
JC
Maximum Thermal
Resistance1 –
Junction to Case
DFN3030-12
(Note 6)
21 °C/W
Notes: 4. Determined by the average current levels of all active channels.
5. Defined as the deviation of any sink current from the average of all active current channels.
6.
Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.