Diodes AL5812 - Manual (Page 2)

AL5812
Document number: DS35616 Rev. 2 - 2
2 of 11
www.diodes.com
November 2013
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UC
T
AL5812
Pin Descriptions
Pin
Name
Pin Number Function
(MSOP8-EP) (U-DFN3030-6)
V
CC
1 1
Power Supply Input.
Connect a 0.1μF ceramic capacitor between V
CC
and GND as close as possible to the
device.
R
SET
4 3
LED Current Setting Pin.
Connect a resistor from this pin to GND: I
LED
= 750/R
SET
May also be used to provide PWM dimming functionality.
GND 5 4 Ground Reference Point of Device.
LED 8 6 LED Current Sink Output.
NC 2, 3, 6, 7 2, 5 No Connection.
EP EP EP
Exposed Pad (bottom).
Used to improve thermal impedance of package.
It must be connected to GND directly underneath the package but not used as sole GND
potential terminal.
Functional Block Diagram
Absolute Maximum Ratings
(@T
A
= +25°C, unless otherwise specified.)
Symbol Parameters Ratings Unit
V
CC
Supply Voltage Relative to GND Pin (Note 4) -0.3 to +66 V
V
LED
LED Pin Voltage Relative to GND Pin (Note 4) -0.3 to +66 V
V
RSET
R
SET
Pin Voltage Relative to GND Pin -0.3 to +6 V
I
LED
LED Pin Current Sink Current Range 165 mA
ESD HBM Human Body Model ESD Protection 1 kV
ESD CDM Charged Device Model ESD Protection 1.2 kV
T
J
Operating Junction Temperature -40 to +150 °C
T
ST
Storage Temperature -55 to +150 °C
Note: 4.V CC pin can be greater or smaller than V LED ; neither should go below GND.
Caution: Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only;
functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be
affected by exposure to absolute maximum rating conditions for extended periods of time.
Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when
handling and transporting these devices.