Diodes AP9060 - Manual (Page 2)

AP9060
Document number: DS36001 Rev. 2 - 2
2 of 9
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August 2012
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UC
T
AP9060
Pin Descriptions
Pin
Number
Pin
Name
Function
1 VIN Input voltage to the device.
2 GND System ground.
3/PAD VOUT Output loltage, which follows V
IN
and gets clamped if V
IN
exceeds the clamp voltage of 11.15V (typ).
Functional Block Diagram
Figure 2 Functional Block Diagram
Absolute Maximum Ratings
(Note 4) (@T
A
= +25°C, unless otherwise specified.)
Symbol Parameter Rating Unit
V
IN
Input Supply Voltage -0.3 to +30 V
I
MAX
Maximum Continuous Switch Current (Note 6)
T
A
= +25°C
T
A
= +85°C
2.6
1.6
A
P
D
Power Dissipation @ T
A
= +25°C (Note 6) 1.1 W
T
J
Junction Temperature Range -40 to +125 °C
T
STG
Storage Temperature Range -55 to +150 °C
T
L
Maximum Lead Temperature for Soldering Purposes 260 °C
ESD Susceptibility (Note 5)
HBM Human Body Model 8.0 kV
MM Machine Model 350 V
Notes: 4. Stresses greater than the 'Absolute Maximum Ratings' specified above may cause permanent damage to the device. These are stress ratings only;
functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be
affected by exposure to absolute maximum rating conditions for extended periods of time.
5. Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling
and transporting these devices.