New prod uc t zxbm5210, Thermal performance, Zxbm5210 – Diodes ZXBM5210 User Manual
Page 13
ZXBM5210
Document number: DS36765 Rev. 1 - 2
13 of 17
December 2013
© Diodes Incorporated
NEW PROD
UC
T
ZXBM5210
Thermal Performance
(1) Package Type: SO-8
MSOP8-EP Power Dissipation De-rating Curve (Note 11)
T
A
(
°C)
-40 0 25 50 60 70 80 85 90 95 100 105 110 120 125 130 140 150
P
D
(mW) 1043
1043
1043
835 751 668 584 543 501 459 417 376 334 250 209 167 83 0
Note:
11. SO-8 soldered to minimum recommended landing pads (see Package Outline Dimension section) on a 1”x1” two-layer 2oz.copper FR4 PCB
(1.6mm thickness) without any via or copper flood on the bottom layer.
(2) Package Type: SO-8EP
SO-8EP Power Dissipation De-rating Curve (Note 12)
T
A
(
°C)
-40 0 25 50 60 70 80 85 90 95 100 105 110 120 125 130 140 150
P
D
(mW) 2980
29080
2980 2384
2146
1907 1669 1550 1430 1430 1192 1073
954 715 596 477 238 0
Note:
12. SO-8EP exposed pad soldered to minimum recommended landing pads (see Package Outline Dimension section) on a 2”x2” two-layer
2oz.copper FR4 PCB (1.6mm thickness) with four thermal vias in the exposed PAD to the copper flood on the bottom layer
0
200
400
600
800
1000
1200
-40
-20
0
20
40
60
80
100
120
140
160
P
o
w
e
r D
is
s
ipa
ti
on
(m
W)
Temperature (°C)
SO-8 Thermal Derating Curve
Rthja = 120
o
C/W;
Rthjc = 19.9
o
C/W
0
250
500
750
1000
1250
1500
1750
2000
2250
2500
2750
3000
3250
3500
-40
-20
0
20
40
60
80
100
120
140
160
P
o
w
e
r D
is
s
ipa
tion
(m
W)
Temperature (°C)
SO-8EP Thermal Derating Curve
Rthja = 42.1
o
C/W; Rthjc = 8.5
o
C/W