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16 chapter 2: hardware information – Asus P6X58-E WS User Manual

Page 40

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P6X58-E WS Motherboard

Qualified Vendors Lists (QVL) DDR3-1333MHz capability

Vendor

Part No.

Size

SS/

DS

Chip

Brand

Chip NO.

Timing

Dimm(Bios)

Voltage

DIMM socket

support (Optional)
A* B* C* D*

A-DATA

AD31333E002G0U

6144MB(Kit of 3) DS N/A

Heat-Sink Package

7-7-7-20(1333-9-9-9-24) 1.65-1.85 V V

V

V

CORSAIR TR3X3G1333C9 (Ver2.1)

3072MB(Kit of 3) SS N/A

Heat-Sink Package

9-9-9-24(1333-9-9-9-24) 1.5

V V

V

CORSAIR CM3X1024-1333C9DHX

1024MB

DS N/A

Heat-Sink Package

(1333-9-9-9-24)

1.1

V V

V

CORSAIR BoxP/N:TWIN3X2048-1333C9

(CM3X1024-1333C9)Ver1.1

2048MB(Kit of 2) DS N/A

Heat-Sink Package

9-9-9-24(1066-7-7-7-20) 1.70

V V

V

V

CORSAIR BoxP/N:TW3X4G1333C9DHX

(CM3X2048-1333C9DHX)Ver3.2

4096MB(Kit of 2) DS N/A

Heat-Sink Package

9-9-9-24(1066-7-7-7-20) 1.70

V V

CORSAIR TR3X6G1333C9 (Ver2.1)

6144MB(Kit of 3) DS N/A

Heat-Sink Package

9-9-9-24(1333-9-9-9-24) 1.5

V V

V

Crucial

CT12864BA1339.8SFB

1024MB

SS MICRON D9GTS

(1333-9-9-9-24)

V V

V

V

Crucial

CT12864BA1339.8SFD

1024MB

SS MICRON MT8JF12864AY-1G4D1 (1333-9-9-9-24)

V V

V

V

Crucial

CT25664BA1339.16SFD

2048MB

DS MICRON D9JNM

(1333-9-9-9-24)

V V

V

V

ELPIDA

EBJ11UD8BAFA-DG-E

1024MB

DS ELPIDA

J5308BASE-DG-E

(1333-8-8-8-24)

V

G.SKILL

F3-10600CL7D-2GBPI

2048MB(Kit of 2) SS N/A

Heat-Sink Package

(1337-7-7-7-18)

1.65

V V

V

V

G.SKILL

F3-10600CL8D-2GBHK

2048MB(Kit of 2) SS N/A

Heat-Sink Package

(1337-8-8-8-22)

1.65

V V

V

V

G.SKILL

F3-10600CL9D-2GBNQ

2048MB(Kit of 2) DS N/A

Heat-Sink Package

(1333-9-9-9-24)

1.5-1.65 V V

V

V

KINGMAX FLFD45F-B8EE9

1024MB

SS ELPIDA

J1108BASE-DJ-E

(1333-9-9-9-24)

V V

V

V

KINGSTON KVR1333D3N9/1G

1024MB

SS ELPIDA

J1108BASE-DJ-E

(1333-9-9-9-24)

1.5

V V

V

V

KINGSTON KVR1333D3N9/2G

2048MB

DS ELPIDA

J1108BASE-DJ-E

(1333-9-9-9-24)

1.5

V V

V

V

MICRON MT8JTF12864AY-1G4BYES

1024MB

SS MICRON Z9HWR

(1333-9-9-9-24)

V V

MICRON MT16JTF25664AY-1G4BYES 2048MB

DS MICRON Z9HWR

(1333-9-9-9-24)

V V

V

V

OCZ

OCZ3RPX1333EB2GK

1024MB

SS N/A

Heat-Sink Package

(1066-6-5-5-20)

V

OCZ

OCZ3X13333GK

3072MB(Kit of 3) SS N/A

Heat-Sink Package

7-7-7(1066-6-6-6-16)

1.6

V V

OCZ

OCZ3P13332GK

1024MB

DS N/A

Heat-Sink Package

7-7-7-20(1333-9-9-9-24)

V

OCZ

OCZ3P13334GK

4096MB(Kit of 2) DS N/A

Heat-Sink Package

7(1333-7-7-7-20)

1.8

V V

V

V

OCZ

OCZ3RPX1333EB4GK

4096MB(Kit of 2) DS N/A

Heat-Sink Package

(1066-6-5-5)

1.85

V

OCZ

OCZ3G1333LV6GK

6144MB(Kit of 3) DS N/A

Heat-Sink Package

9-9-9(1066-7-7-7-20)

1.65

V V

OCZ

OCZ3P1333LV6GK

6144MB(Kit of 3) DS N/A

Heat-Sink Package

7-7-7(1066-7-7-7-20)

1.65

V V

V

V

Qimonda IMSH2GU13A1F1C-13H

2048MB

DS Qimonda IDSH1G-03A1F1C-13H 9(1333-9-9-9-24)

V V

V

V

SAMSUNG M378B2873DZ1-CH9

1024MB

SS SAMSUNG K4B1G0846D

9(1333-9-9-9-24)

V V

V

V

SAMSUNG M391B2873DZ1-CH9

1024MB

SS SAMSUNG K4B1G0846D(ECC)

9(1333-9-9-9-24)

V V

V

V

SAMSUNG M378B5673DZ1-CH9

2048MB

DS SAMSUNG K4B1G0846D

9(1333-9-9-9-24)

V V

V

V

SAMSUNG M391B5673DZ1-CH9

2048MB

DS SAMSUNG K4B1G0846D(ECC)

9(1333-9-9-9-24)

V V

V

V

Transcend TS128MLK64V3U

1024MB

SS SAMSUNG K4B1G0846D

9(1333-9-9-9-24)

V V

V

Transcend TS256MLK64V3U

2048MB

DS SAMSUNG K4B1G0846D

9(1333-9-9-9-24)

V V

V

Aeneon

AEH760UD00-13H

1024MB

DS AENEON AEH93R13H

(1333-9-9-9-24)

V V

V

V

BUFFALO FSX1333D3G-1G

1024MB

SS N/A

Heat-Sink Package

(1066-7-7-7-20)

V V

V

V

BUFFALO FSX1333D3G-2G

2048MB

DS N/A

Heat-Sink Package

(1066-7-7-7-20)

V V

V

V

Elixir

M2F2G64CB8HA4N-CG

2048MB

DS Elixir

N2CB1G80AN-CG

(1333-9-9-9-24)

V V

V

V

Patriot

PDC32G1333LLK

1024MB

SS PATRIOT Heat-Sink Package

7(1337-7-7-7-20)

1.7

V V

V

V

Patriot

PVT33G1333ELK

3072MB(Kit of 3) SS N/A

Heat-Sink Package

9-9-9-24(1066-7-7-7-20) 1.65

V V

V

V

Patriot

PVT36G1333ELK

6144MB(Kit of 3) DS N/A

Heat-Sink Package

9-9-9-24(1066-7-7-7-20) 1.65

V V

V

V

2-16

Chapter 2: Hardware information