Q-Tech QT806 Sine Wave - Manual (Page 7)

Q-TECH Corporation
10150 W. Jefferson Blvd.
Culver City, CA 90232
SIZE
A
CAGE NO.
51774
QT804, QT805 and QT806
Sine-Wave 24 DDIP REV.
E
Page 7 of 10
3.3.1 All piece parts shall be derived from lots that meet the element evaluation requirements of MIL-PRF-
38534, Class K, with the following exceptions:
Active elements
a) Visual inspection of silicon on sapphire microcircuits. Semicircular crack(s) or multiple adjacent
cracks, not in the active area, starting and terminating at the edge of the die are acceptable.
Attached (chip in place) sapphire is nonconductive material and shall not be considered as foreign
material and will be considered as nonconductive material for all inspection criteria.
b) Subgroup 4, Scanning Electron Microscope (SEM) inspection. The manufacturer may allow the die
distributor, at his option, to select two (2) dice from a waffle pack (containing a maximum quantity
of 100 die), visually inspect for the worst case metallization of the 2 dice, and take SEM
photographs of the worst case.
c) Subgroup
5 radiation tests. Subgroup 5 radiation tests are not required unless otherwise specified in the detail
purchase order.
3.3.2 Processes - Processes used for manufacturing the TCXO are selected on the basis of their ability to
meet the quality requirements for space High Reliability manufacturing. Travelers or Process Cards are
used in the manufacturing and testing of all of the TCXO Series, and might be available for customer
review. Copies of these Travelers can be provided with the TCXOs at time of shipment if so specified
on the purchase order
.
3.3.3 Interchangeability - Each TCXO shall be interchangeable without using a special selection process.
3.3.4 Product Marking - Each unit shall be permanently marked with the manufacturer's name or symbol,
part number, lot date code number, and serial number. The unit shall be marked with the outline of
an equilateral triangle near pin 1 to show that it contains devices which are sensitive to electrostatic
discharge.
3.4 Parts Program
Devices delivered to this specification represent the standardized Parts, Materials and Processes (PMP)
Program developed, implemented and certified for advanced applications and extended environments.
3.4.1 Quartz Crystal Resonator - The crystal resonator used shall be constructed using a 4-point mount
premium synthetic swept Quartz and procured to Q-TECH SCD. (For the Engineering models, non-
swept quartz may be used).
3.4.2 Active devices – Radiation testing is not performed at the oscillator level, but these TCXOs have been
acceptable for use in environments up to 100K rads by analysis of the components used. ONLY Bipolar
semiconductors are employed in the design. This device is specified to be radiation tolerant to:
100 kRad(Si) total ionizing dose(TID)
3.4.3 Prohibited Materials: Materials containing more than 97% tin and materials containing measurable
amounts (by common nondestructive test methods) of selenium, cadmium, or mercury shall not be
used as plating, coating or base materials in the construction of parts or components. Zinc is only
acceptable as an alloying element and alloys containing zinc must be covered by suitable protective
plating (e.g. nickel plating). Inert oxides of the above materials are allowed.
3.5 Traceability Requirements
Material, element and process traceability requirements shall be as specified by MIL-PRF-38534 for