Rainbow Electronics MAX17101 - Manual (Page 9)

MAX17101
Dual Quick-PWM, Step-Down Controller
with Low-Power LDO, RTC Regulator
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ELECTRICAL CHARACTERISTICS (continued)
(Circuit of Figure 1, no load on LDO, RTC, OUT1, OUT2, and REF, V IN = 12V, V DD = V CC = V SECFB = 5V, V REFIN2 = 1.0V, BYP =
LDOSEL = GND, ONLDO = IN, ON1 = ON2 = V CC , T A = -40°C to +85°C, unless otherwise noted.) (Note 3)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
OUT2 Undervoltage-Protection
Trip Threshold
V UVP(OUT2) With respect to error-comparator threshold 60 80 %
PGOOD2 Lower Trip Threshold
With respect to error-comparator threshold,
falling edge, hysteresis = 2%
-20 -10 %
PGOOD2 Output-Low Voltage
V OUT2 = V REFIN2 - 150mV (PGOOD2 low
impedance), I SINK = 4mA
0.4 V
CURRENT LIMIT
ILIM_ Adjustment Range V ILIM 0.2 2.0 V
R ILIM _ = 100k 40 60 Valley Current-Limit Threshold
(Adjustable)
V VALLEY V AGND - V LX _
R ILIM _ = 200k 85 115
mV
GATE DRIVERS
DH_ Gate Driver On-Resistance R DH BST1 - LX1 and BST2 - LX2 forced to 5V 3.5
DL1, DL2; high state 4.5
DL_ Gate Driver On-Resistance R DL
DL1, DL2; low state 1.5
INPUTS AND OUTPUTS
High
V CC -
0.4V
REF or open 1.6 3.0
TON Input Logic Levels
Low 0.4
V
High (forced PWM)
V CC -
0.4V
Open (ultrasonic) 1.6 3.0
SKIP Input Logic Levels
Low (skip) 0.4
V
High (SMPS on) 2.4
ON_ Input Logic Levels
Low (SMPS off) 0.8
V
High (SMPS on) 2.4
ONLDO Input Logic Levels
Low (SMPS off) 0.8
V
Note 1: DC output accuracy specifications refer to the threshold of the error comparator. When the inductor is in continuous conduc-
tion, the MAX17101 regulates the valley of the output ripple, so the actual DC output voltage is higher than the trip level by
50% of the output ripple voltage. In discontinuous conduction (I
OUT < I LOAD(SKIP) ), the output voltage has a DC regulation
level higher than the error-comparator threshold by approximately 1.5% due to slope compensation.
Note 2: On-time and off-time specifications are measured from 50% point to 50% point at the DH pin with LX = PGND, VBST = 5V,
and a 500pF capacitor from DH to LX to simulate external MOSFET gate capacitance. Actual in-circuit times might be differ-
ent due to MOSFET switching speeds.
Note 3: Specifications to T A = -40°C are guaranteed by design and not production tested.
Note 4: Specifications increased by 1
Ω to account for test measurement error.