Package information – Rainbow Electronics MAX9770 User Manual
Page 22
MAX9770
1.2W Low-EMI, Filterless, Mono Class D Amplifier
with Stereo DirectDrive Headphone Amplifiers
22
______________________________________________________________________________________
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information
go to
www.maxim-ic.com/packages
.)
QFN THIN.EPS
D2
(ND-1) X e
e
D
C
PIN # 1
I.D.
(NE-1) X e
E/2
E
0.08 C
0.10 C
A
A1 A3
DETAIL A
0.15 C B
0.15 C A
E2/2
E2
0.10 M C A B
PIN # 1 I.D.
b
0.35x45∞
L
D/2
D2/2
L
C
L
C
e
e
L
C
CL
k
k
L
L
E
1
2
21-0140
PACKAGE OUTLINE
16, 20, 28, 32, 40L, THIN QFN, 5x5x0.8mm
DETAIL B
L
L1
e
Note:
The MAX9770 thin QFN package features an exposed thermal pad on its underside. This pad lowers the package’s thermal resis-
tance by providing a direct heat conduction path. Due to the high efficiency of the MAX9770’s Class D amplifier, additional
heatsinking is not required. The voltage of the exposed paddle is -V
DD
and it is important that the exposed paddle is NOT con-
nected to the ground plane. It should be either left floating or can be tied to the CPV
SS
pin. See the MAX9770 EV kit data sheet for
suggested component values and layout guidelines.