Vishay high power products, Hexfred, Ultrafast diodes, 100 a (new int-a-pak – Vishay VSKDU162-12PbF User Manual
Page 2: Power modules)
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Document Number: 94512
2
Revision: 25-Apr-08
VSKDU162/12PbF
Vishay High Power Products
HEXFRED
®
Ultrafast Diodes, 100 A
(New INT-A-PAK
TM
Power Modules)
BLOCKING
PARAMETER
SYMBOL
TEST CONDITIONS
VALUES
UNITS
Maximum peak reverse
leakage current
I
RRM
T
J
= 150 °C
30
mA
RMS insulation voltage
V
INS
50 Hz, circuit to base, all terminals shorted, t = 1 s
3500
V
THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
TEST CONDITIONS
VALUES
UNITS
Maximum junction operating and
storage temperature range
T
J
, T
Stg
- 40 to 150
°C
Maximum thermal resistance,
junction to case per junction
R
thJC
DC operation
0.18
K/W
Typical thermal resistance,
case to heatsink
R
thCS
Mounting surface, flat, smooth and greased
0.05
Mounting
torque ± 10 %
to heatsink
A mounting compound is recommended and the
torque should be rechecked after a period of 3 hours
to allow the spread of the compound.
4 to 6
Nm
busbar
Approximate weight
200
g
7.1
oz.
Case style
New INT-A-PAK