Texas Instruments MSP430 User Manual
Page 48
MSP-TS430DW28
www.ti.com
Table B-6. MSP-TS430DW28 Bill of Materials
No. per
Position
Ref Des
Description
DigiKey Part No.
Comment
Board
DNP: C1, C2, Cover holes while
1
C1, C2
0
12pF, SMD0805
soldering
2
C5
1
100nF, SMD0805
3
C7
1
10uF/10V Tantal Elko B
4
C8
1
10nF
SMD0805
5
D1
1
LED3 T1 3mm yellow
RS: 228-4991
Micro Crystal MS1V-T1K
6
Q1
0
QUARZ, Crystal
32.768kHz, C(Load) =
DNP: Cover holes while soldering
12.5pF
DNP: Headers and receptacles
7
J1, J2
2
14-pin header, TH male
enclosed with kit. Keep vias free of
solder.: Header: Receptacle
DNP: Headers and receptacles
14-pin header, TH
7.1
2
enclosed with kit. Keep vias free of
female
solder.: Header: Receptacle
8
J3
1
3-Pin Connector, male
9
J4, J5
2
2-Pin Connector, male
With jumper
10
BOOTST
0
ML10, 10-Pin Conn., m
RS: 482-115
DNP, Cover holes while soldering
11
JTAG
1
ML14, 14-Pin Conn., m
RS: 482-121
R1, R2,
R6, R7,
12
4
0R, SMD0805
DNP: R1, R2, R9, R10
R8,R9,
R10, R11
13
R3
1
560R, SMD0805
14
R5
1
47K, SMD0805
Yamaichi:
15
U1
1
SOP28DW socket
IC189-0282-042
16
U2
0
TSSOP
DNP
48
Hardware
SLAU278F – May 2009 – Revised December 2010
© 2009–2010, Texas Instruments Incorporated