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Easurement points, Nse-8 – Nokia 3210 User Manual

Page 34

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CONFIDENTIAL

Service & Analysis Center Europe

Training Team

version 1.0 / 05.11.1999

Page 34 of 37

The pictures indicate a typically case of broken solder ball
under the μBGA. On the right you can see the little part of the
COBBA IC view with a microscope. The PCB is on the
top, and the COBBA are with the body to the bottom of
the picture. The picture below shows a broken ball view
through a X-ray machine

No TX-Power or to low

See also the troubleshooting chapter 4.GSM transmitter and 5. PCN transmitter from service manual

Z500 Duplexer Filter (Low TX-Power on GSM 900)

Check the TX-Power level between the TX "in" and "Antenna" pad of the duplexer

Resolder the ground and signal connection pads of the duplexer

Change the duplexer

Z504 RX/TX switch GSM1800 (Low TX-Power on GSM 1800)

Check the 1V DC TX-switching voltage on Z504

Check the TX-power difference between "TX" and "ANT" pad on Z504

Change the Z504 if more than 2dBm difference are measurable

N500 /N501 Power Amplifier GSM 900 /GSM 1800

Check the power supply VDC_OUT(3,2V

4,2V dependent to the power level) N500 /N501 pin 3

Check the input power on pin N500/ N501 depend of the band (nominal 0dbm)

Check the outgoing power on pin 4 N500/ N501

Check the TX-Power control signal on pin 2 N500/ N501 , 0,7Vpp-1,7Vpp / 0,12..V - 0,2..V DC dependent of the
power-level (see the diagram below)

Change the PA if no power or to low power comes out and the power supply and control line are OK