SMSC USB97C242 - Manual (Page 20)

USB 2.0 Flash Drive Controller
Datasheet
SMSC USB97C242 Page 20 Revision 1.4 (05-03-07)
DATASHEET
Chapter 9 Package Outline
Figure 9.1 – 100 Pin TQFP Package Outline, 12x12x1.4 Body (Rev A)
Table 9.1 – 100 Pin TQFP Package Parameters (Rev A)
MIN NOMINAL MAX REMARKS
A ~ ~ 1.60 Overall Package Height
A1 0.05 ~ 0.15 Standoff
A2 1.35 ~ 1.45 Body Thickness
D 13.80 ~ 14.20 X Span
D1 11.80 ~ 12.20 X body Size
E 13.80 ~ 14.20 Y Span
E1 11.80 ~ 12.20 Y body Size
H 0.09 ~ 0.20 Lead Frame Thickness
L 0.45 0.60 0.75 Lead Foot Length
L1 ~ 1.00 ~ Lead Length
e 0.40 Basic Lead Pitch
θ 0 o ~ 7 o Lead Foot Angle
W 0.13 0.16 0.23 Lead Width
R1 0.08 ~ ~ Lead Shoulder Radius
R2 0.08 ~ 0.20 Lead Foot Radius
ccc ~ ~ 0.08 Coplanarity
Notes:
1
Controlling Unit: millimeter.
2
Tolerance on the position of the leads is ± 0.035 mm maximum.
3 Package body dimensions D1 and E1 do not include the mold protrusion.
Maximum mold protrusion is 0.25 mm.
4
Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
5
Details of pin 1 identifier are optional but must be located within the zone indicated.