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1 introduction – Sundance SMT784 User Manual

Page 6

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User Manual SMT784

Page 6 of 31

Last Edited: 19/03/2009 14:12:00

1 Introduction

The SMT784 is a Virtex 5 based PXI form-factor system utilizing Sundance’s
SMT700 carrier board and the SMT384 quad 125MSPS ADC mezzanine board. The
SMT700 implements up to eight 2.5-Gigabit PCI Express lanes, allowing a maximum
data transfer of 2 gigabytes per second. It also implements optionally a 32-bit, 33-
MHz PCI interface. As a standard, the ADCs are all AC-coupled (RF Transformers),
but can also be optionally DC-coupled (TI opamp

THS4509

). ADC configuration,

sampling, and transferring modes are set via internal control registers stored inside
the FPGA and accessible via a Comport interface.
The front panel interfaces make inter-system capabilities extremely extensive, while
the ADC’s and configurable clock distribution attached to the mezzanine module
(SMT384) make processing raw data fast and simple to configure.
Together, the SMT784 is a powerful system for capturing and manipulating data at
high speeds.

Main features of system:

• Xilinx Virtex 5 in an FF1136 package. Supports LX50T/LX85T/SX50T or

LX110T/SX95T.

• FPGA configuration from flash (64MB) using a Xilinx Coolrunner CPLD.
• One 64-bit wide data bank of DDR2 memory. The bank uses 4, 16-bit wide

devices. Running this memory at 220MHz provides a maximum access speed
of over 3.5Gbyte/s.

Sundance LVDS Bus (SLB) connector for interfacing the SMT700 carrier with

the SMT384 mezzanine. (Future expanded functionality can be achieved as
well by utilizing any one of Sundance’s long line of other mezzanine
modules)

• Front panel SATA connectors carrying Virtex 5 serial interfaces.
• Front panel RJ45 for gigabit Ethernet.
• Front panel Fibre Optic modules carrying Virtex 5 Serial interfaces.
• Sundance Rocket Serial Link (RSL) connector with 4 serial interfaces.
• Front panel USB interface to allow re-programming of the flash memory.
• Four 14-bit, 125MSPS analogue to digital converters.
• Flexible, on-board, low-jitter clock generation.
• One external clock, external triggers, and one reference clock via MMCX

connector.

• All analogue inputs to be connected to 50-ohm sources/loads.
• Mezzanine module temperature sensors.