9 power and thermal – Sundance SMT784 User Manual
Page 30

User Manual SMT784
Page 30 of 31
Last Edited: 19/03/2009 14:12:00
9 Power and Thermal
9.1 Power Dissipation
The PXI Express chassis receiving the SMT784 system should provide enough forced
air flow in order to dissipate the heat generated by the modules. The air flow must
be going against gravity or upwards, as specified in the PXI Specification.
It is also specified that a 3U PXI Express module should not dissipate more than 30
Watts of heat.
The following picture shows the direction of the forced air flow across a 3U PXI
Express module:
Figure 13 3U Heat Dissipation
The estimated maximum power consumption of the Virtex5 FPGA is 22W. This
assumes a design running at 500MHz with all DSP slices used.
All of the devices on the SMT784 derive their power from the +12V PXI power rails.
It is strongly advised, as applications vary considerably, to use the Xilinx power
estimator tools available from this link;
Xilinx Power Design Solutions
- SMT107 (16 pages)
- SMT6035 v.2.2 (39 pages)
- SMT6012 v.4.6 (22 pages)
- FC100 (12 pages)
- FC108 v.1.1 (10 pages)
- SMT6065 v.4.0 (45 pages)
- FFT v.2.1 (19 pages)
- SMT111 (18 pages)
- SMT118LT (10 pages)
- SMT118 (20 pages)
- SMT123-SHB (13 pages)
- SMT128 (15 pages)
- SMT145 (18 pages)
- SMT148 (35 pages)
- SMT130 v.1.0 (46 pages)
- SMT148FX (48 pages)
- SMT310Q (55 pages)
- PARS (70 pages)
- SMT166-FMC (52 pages)
- SMT166 (44 pages)
- SMT300Q v.1.6 (61 pages)
- SMT310 v.1.6 (50 pages)
- SMT317 (24 pages)
- SMT326v2 (24 pages)
- SMT338 (19 pages)
- SMT349 (32 pages)
- SMT339 v.1.3 (27 pages)
- SMT338-VP (22 pages)
- SMT358 (25 pages)
- SMT351T (37 pages)
- SMT351 (25 pages)
- SMT350 (45 pages)
- SMT362 (30 pages)
- SMT365G (23 pages)
- SMT364 (37 pages)
- SMT373 (15 pages)
- SMT368 (24 pages)
- SMT370v3 (46 pages)
- SMT377 (22 pages)
- SMT381 2007 (31 pages)
- SMT381-VP (81 pages)
- SMT387 (42 pages)
- SMT391 (18 pages)
- SMT384 (47 pages)
- SMT390-VP (55 pages)